Inventor · disambiguated record
Fumito Suzuki
Also filed as: SUZUKI FUMITO
13 granted patents·2 pending applications·154 citations·filing 1995–2023
90Inventor score
Top patents by PatentIndex Score
15 records- 0186US6713794B2Lateral semiconductor deviceTOSHIBA KK·Filed 2001·Granted Mar 30, 2004·48 cites·14 claims
- 0281US12173151B2Polyphenylene ether resin composition, prepreg using same, film with resin, metal foil with resin, metal-clad laminate and wiring boardPANASONIC IP MAN CO LTD·Filed 2023·Granted Dec 24, 2024·0 cites·12 claims
- 0377US6150702ALateral high-voltage semiconductor device having an outwardly extended electrodeTOSHIBA KK·Filed 1999·Granted Nov 21, 2000·39 cites·20 claims
- 0472US8927972B2Current-amplifying transistor device and current-amplifying, light-emitting transistor deviceNAKAYAMA KEN-ICHI·Filed 2010·Granted Jan 6, 2015·3 cites·30 claims
- 0567US5982015AHigh breakdown voltage semiconductor deviceTOSHIBA KK·Filed 1999·Granted Nov 9, 1999·24 cites·18 claims
- 0666US11866580B2Polyphenylene ether resin composition, prepreg using same, film with resin, metal foil with resin, metal-clad laminate and wiring boardPANASONIC IP MAN CO LTD·Filed 2018·Granted Jan 9, 2024·0 cites·11 claims
- 0763US5821031APhotosensitive solder resist ink, printed circuit board and production thereofGOO CHEMICAL CO LTD·Filed 1995·Granted Oct 13, 1998·26 cites·16 claims
- 0861US6677622B2Semiconductor device having insulated gate bipolar transistor with dielectric isolation structureTOSHIBA KK·Filed 2002·Granted Jan 13, 2004·10 cites·7 claims
- 0954US9458284B2Carboxyl-containing resin, resin composition for solder mask, and method of preparing carboxyl-containing resinGOO CHEMICAL CO LTD·Filed 2012·Granted Oct 4, 2016·0 cites·10 claims
- 1051US11312858B2Resin composition, prepreg, film including resin, metal foil including resin, metal-clad laminate, and wiring boardPANASONIC IP MAN CO LTD·Filed 2018·Granted Apr 26, 2022·0 cites·10 claims
- 1147US2020181403A1Poly(phenylene ether) resin composition, and prepreg, metal-clad laminate, and wiring board each obtained using samePANASONIC IP MAN CO LTD·Filed 2018·Application pending·0 cites
- 1242US2008237707A1Semiconductor deviceTOSHIBA KK·Filed 2007·Application pending·0 cites
- 1340US9128375B2Resin composition for masksHIGUCHI MICHIYA·Filed 2012·Granted Sep 8, 2015·0 cites·8 claims
- 1436US6133617AHigh breakdown voltage semiconductor deviceTOSHIBA KK·Filed 1999·Granted Oct 17, 2000·4 cites·19 claims
- 1529US9468109B2Method for fabricating wiring boardPANASONIC IP MAN CO LTD·Filed 2015·Granted Oct 11, 2016·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →