Inventor · disambiguated record
Fumihito Tachibana
Also filed as: TACHIBANA FUMIHITO
1 granted patent·1 pending application·0 citations·filing 2023–2023
8Inventor score
Files withDENSO CORP2
Top patents by PatentIndex Score
2 records- 0150US12501712B2Method of forming grooves and vertical cracks in a wafer comprising individual semiconductor elements to separate the semiconductor elements by cleaving the wafer along the grooves and the vertical cracksDENSO CORP·Filed 2023·Granted Dec 16, 2025·0 cites·6 claims
- 0238US2024072143A1Semiconductor device and method for manufacturing the sameDENSO CORP·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →