Inventor · disambiguated record
Fu-Yung Tsai
Also filed as: TSAI FU-YUNG
1 granted patent·2 pending applications·9 citations·filing 2012–2024
31Inventor score
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3 records- 0168US8937376B2Semiconductor packages with heat dissipation structures and related methodsTSAI FU-YUNG·Filed 2012·Granted Jan 20, 2015·9 cites·19 claims
- 0258US2025120617A1Non-invasive blood glucose monitoring device and manufacturing method thereofTAIWAN ASIA SEMICONDUCTOR CORP·Filed 2024·Application pending·0 cites
- 0353US2025283812A1Optical sensing device and method for manufacturing the sameTAIWAN ASIA SEMICONDUCTOR CORP·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →