Inventor · disambiguated record

Fu Mauh Wong

Also filed as: WONG FU MAUH

0 granted patents·2 pending applications·0 citations·filing 2002–2006

Technology areasH10W

Files withWONG WENG FEI1

Top patents by PatentIndex Score

2 records

0141US2008122122A1Semiconductor package with encapsulant delamination-reducing structure and method of making the packageWONG WENG FEI·Filed 2006·Application pending·0 cites
0236US2004120117A1Electronic package with improved thermal performanceFiled 2002·Application pending·0 cites

Join the waitlist — get patent alerts

Get an alert when Fu Mauh Wong files or is granted a new patent.

We store only your email — no account needed. See our privacy policy.

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →