Inventor · disambiguated record
Fu-Hsiang Yao
Also filed as: YAO FU · YAO FU-HSIANG
1 granted patent·2 pending applications·1 citations·filing 2008–2017
15Inventor score
Top patents by PatentIndex Score
3 records- 0171US10166705B2Method of manufacturing housing structure and housing structureJTEKT CORP·Filed 2017·Granted Jan 1, 2019·1 cites·8 claims
- 0234US2010000869A1Method For Anodizing An Aluminum MaterialMAW CHENG ENTPR CO LTD·Filed 2008·Application pending·0 cites
- 0321US2010319968A1Aluminum circuit board and method and electroplating solution for making the sameYAO FU-HSIANG·Filed 2010·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Fu-Hsiang Yao files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →