Inventor · disambiguated record
Ganesh Hegde
Also filed as: HEGDE GANESH · HEGDE GANESH GOPALKRISHNA
19 granted patents·1 pending application·36 citations·filing 2014–2024
91Inventor score
Top patents by PatentIndex Score
20 records- 0195US11537898B2Generative structure-property inverse computational co-design of materialsSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Dec 27, 2022·5 cites·20 claims
- 0292US9831323B2Structure and method to achieve compressively strained Si NSSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Nov 28, 2017·8 cites·20 claims
- 0389US11586982B2Electronic and atomic structure computation utilizing machine learningSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 21, 2023·3 cites·20 claims
- 0485US9634140B2Fabricating metal source-drain stressor in a MOS device channelSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Apr 25, 2017·4 cites·34 claims
- 0582US11043454B2Low resistivity interconnects with doped barrier layer for integrated circuitsSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jun 22, 2021·3 cites·8 claims
- 0682US9613907B2Low resistivity damascene interconnectSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Apr 4, 2017·4 cites·20 claims
- 0780US11087055B2Method of screening materials using forward conducting modesSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Aug 10, 2021·3 cites·14 claims
- 0877US10381315B2Method and system for providing a reverse-engineering resistant hardware embedded security moduleSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Aug 13, 2019·2 cites·20 claims
- 0974US9858365B2Physical modeling of electronic devices/systemsPURDUE RESEARCH FOUNDATION·Filed 2014·Granted Jan 2, 2018·3 cites·23 claims
- 1062US10283638B2Structure and method to achieve large strain in NS without addition of stack-generated defectsKITTL JORGE A·Filed 2016·Granted May 7, 2019·1 cites·6 claims
- 1161US11289419B2Interconnects having long grains and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Mar 29, 2022·0 cites·20 claims
- 1258US10311179B2Physical modeling of electronic devices/systemsPURDUE RESEARCH FOUNDATION·Filed 2018·Granted Jun 4, 2019·0 cites·20 claims
- 1357US10916513B2Method and system for providing a reverse engineering resistant hardware embedded security moduleSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 9, 2021·0 cites·20 claims
- 1456US10061877B2Physical modeling of electronic devices/systemsPURDUE RESEARCH FOUNDATION·Filed 2017·Granted Aug 28, 2018·0 cites·20 claims
- 1555US10763207B2Interconnects having long grains and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 1, 2020·0 cites·1 claims
- 1649US2024378264A1System and method for automatic mark management on the blockchainBRAND THERAPY LLC·Filed 2024·Application pending·0 cites
- 1742US10297673B2Methods of forming semiconductor devices including conductive contacts on source/drainsKITTL JORGE A·Filed 2015·Granted May 21, 2019·0 cites·20 claims
- 1840US10510886B2Method of providing reacted metal source-drain stressors for tensile channel stressSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Dec 17, 2019·0 cites·17 claims
- 1937US10510665B2Low-k dielectric pore sealant and metal-diffusion barrier formed by doping and method for forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Dec 17, 2019·0 cites·9 claims
- 2036US9728502B2Metal oxysilicate diffusion barriers for damascene metallization with low RC delays and methods for forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Aug 8, 2017·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →