Inventor · disambiguated record
Gao Huang
Also filed as: HUANG GAO
8 granted patents·26 pending applications·3 citations·filing 2020–2025
73Inventor score
Files withZHUHAI ACCESS SEMICONDUCTOR CO LTD25BEIJING INSTITUTE TECH3UNIV TSINGHUA3BOSCH GMBH ROBERT1NANTONG ACCESS SEMICONDUCTOR CO LTD1
Top patents by PatentIndex Score
34 records- 0183US12033365B2Image processing method and apparatus and storage mediumUNIV TSINGHUA·Filed 2021·Granted Jul 9, 2024·2 cites·18 claims
- 0278US11961277B2Image information detection method and apparatus and storage mediumUNIV TSINGHUA·Filed 2021·Granted Apr 16, 2024·1 cites·20 claims
- 0371US2025329629A1Packaging structure and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2025·Application pending·0 cites
- 0468US2025212337A1Conductive substrate and carrier plate wiring structure with filtering function, and manufacturing method of sameZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2025·Application pending·0 cites
- 0565US12279377B2Conductive substrate and carrier plate wiring structure with filtering function, and manufacturing method of sameZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2022·Granted Apr 15, 2025·0 cites·7 claims
- 0661US2023282565A1Packaging structure and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2022·Application pending·0 cites
- 0759US2024332224A1Embedded magnetic device integrated structure and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2024·Application pending·0 cites
- 0858US2024321594A1Embedded magnet frame, integrated structure and manufacturing methodZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2024·Application pending·0 cites
- 0958US2024274491A1Package carrier plate with embedded efficient heat dissipation module and manufacturing method thereforZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Application pending·0 cites
- 1058US2024312796A1Organic interposer structure, manufacturing method and package structure thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2024·Application pending·0 cites
- 1157US2024312879A1Metal frame chip embedded packaging substrate and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2024·Application pending·0 cites
- 1256US12451447B2Substrate embedded with integrated inductor and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Granted Oct 21, 2025·0 cites·10 claims
- 1355US2024096836A1Chip high-density interconnection package structure and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Application pending·0 cites
- 1455US2024116752A1Packaged cavity structure and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Application pending·0 cites
- 1554US2024186230A1Component package substrate structure and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Application pending·0 cites
- 1654US2024222143A1Embedded and packaged heat dissipation structure and manufacturing method therefor, and semiconductorZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Application pending·0 cites
- 1754US2024266244A1Embedded and packaged heat dissipation structure and manufacturing method therefor, and semiconductorZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Application pending·0 cites
- 1853US11903133B2Structure for embedding and packaging multiple devices by layer and method for manufacturing sameZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2022·Granted Feb 13, 2024·0 cites·20 claims
- 1953US2024222245A1Method for manufacturing embedded device packaging substrate, packaging substrate, and semiconductorZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Application pending·0 cites
- 2053US2024079287A1Method for manufacturing high-heat-dissipation mixed substrate, and semiconductor structureZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Application pending·0 cites
- 2153US2024194578A1Embedded device package substrate and manufacturing method thereforZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Application pending·0 cites
- 2252US2023127494A1Signal-heat separated tmv packaging structure and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2022·Application pending·0 cites
- 2351US2023276576A1Package substrate and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Application pending·0 cites
- 2451US2024047227A1Package substrate with embedded device, and manufacturing method thereforZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Application pending·0 cites
- 2550US2023232545A1Method for manufacturing a packaging substrate, and packaging substrateZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2022·Application pending·0 cites
- 2650US2024153819A1Substrate manufacturing method, embedded substrate and semiconductorZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Application pending·0 cites
- 2750US2024178088A1Package substrate and manufacturing method thereforZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Application pending·0 cites
- 2849US11618519B2Method of tracking control for foot force and moment of biped robotBEIJING INSTITUTE TECH·Filed 2020·Granted Apr 4, 2023·0 cites·11 claims
- 2948US2024202497A1Method and apparatus for computer vision processingBOSCH GMBH ROBERT·Filed 2021·Application pending·0 cites
- 3046US12078234B2Lightweight high load-bearing reducer and method for generating bionic bone structure of gear thereofBEIJING INSTITUTE TECH·Filed 2021·Granted Sep 3, 2024·0 cites·10 claims
- 3146US2024021525A1Packaging structure for realizing chip interconnection and manufacturing method thereofZHUHAI YUEXIN SEMICONDUCTOR LLC·Filed 2023·Application pending·0 cites
- 3244US2024030146A1Multichip interconnecting packaging structure and manufacturing method thereofNANTONG ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Application pending·0 cites
- 3343US12214498B2Robot joint torque control system and load compensation method thereforBEIJING INSTITUTE TECH·Filed 2020·Granted Feb 4, 2025·0 cites·6 claims
- 3439US2022214322A1Air pollutants concentration forecasting method and apparatus and storage mediumUNIV TSINGHUA·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →