Inventor · disambiguated record
Gai Leong Lai
Also filed as: LAI GAI LEONG
1 granted patent·1 pending application·3 citations·filing 2010–2023
21Inventor score
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0166US8802500B2Integrated circuit packaging system with leads and method of manufacture thereofDO BYUNG TAI·Filed 2010·Granted Aug 12, 2014·3 cites·20 claims
- 0239US2024355760A1Semiconductor Device and Method of Forming Stress Relief Vias in Multi-Layer RDLSTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →