Inventor · disambiguated record
Gabriel Maier
Also filed as: MAIER GABRIEL
2 granted patents·1 pending application·6 citations·filing 2012–2018
48Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0176US8951915B2Methods for manufacturing a chip arrangement, methods for manufacturing a chip package, a chip package and chip arrangementsHESS REINHARD·Filed 2012·Granted Feb 10, 2015·6 cites·14 claims
- 0246US9576875B2Methods for manufacturing a chip arrangement, methods for manufacturing a chip package, a chip package and chip arrangementsINFINEON TECHNOLOGIES AG·Filed 2015·Granted Feb 21, 2017·0 cites·11 claims
- 0335US2018233470A1Handling thin wafer during chip manufactureINFINEON TECHNOLOGIES AG·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →