Inventor · disambiguated record
Gamal Refai-Ahmed
Also filed as: REFAI-AHMED GAMAL
69 granted patents·16 pending applications·636 citations·filing 2002–2024
99Inventor score
Files withXILINX INC29REFAI-AHMED GAMAL11GEN ELECTRIC10ADVANCED MICRO DEVICES INC8ATI TECHNOLOGIES ULC8
Top patents by PatentIndex Score
85 records- 0198US11769710B2Heterogeneous integration module comprising thermal management apparatusXILINX INC·Filed 2020·Granted Sep 26, 2023·25 cites·20 claims
- 0297US11373929B1Thermal heat spreader plate for electronic deviceXILINX INC·Filed 2020·Granted Jun 28, 2022·13 cites·20 claims
- 0397US11330738B1Force balanced package mountingXILINX INC·Filed 2020·Granted May 10, 2022·7 cites·18 claims
- 0497US11145566B2Stacked silicon package assembly having thermal managementXILINX INC·Filed 2020·Granted Oct 12, 2021·5 cites·20 claims
- 0596US11195780B1Stacked silicon package assembly having thermal management using phase change materialXILINX INC·Filed 2020·Granted Dec 7, 2021·4 cites·20 claims
- 0696US10529645B2Methods and apparatus for thermal interface material (TIM) bond line thickness (BLT) reduction and TIM adhesion enhancement for efficient thermal managementXILINX INC·Filed 2017·Granted Jan 7, 2020·26 cites·20 claims
- 0796US10262920B1Stacked silicon package having a thermal capacitance elementXILINX INC·Filed 2016·Granted Apr 16, 2019·24 cites·21 claims
- 0896US9812374B1Thermal management device with textured surface for extended cooling limitXILINX INC·Filed 2017·Granted Nov 7, 2017·18 cites·20 claims
- 0995US10043730B2Stacked silicon package assembly having an enhanced lidXILINX INC·Filed 2015·Granted Aug 7, 2018·19 cites·19 claims
- 1095US8193039B2Semiconductor chip with reinforcing through-silicon-viasSU MICHAEL Z·Filed 2010·Granted Jun 5, 2012·22 cites·19 claims
- 1194US11488887B1Thermal enablement of dies with impurity getteringXILINX INC·Filed 2020·Granted Nov 1, 2022·5 cites·9 claims
- 1294US11246211B1Micro device with through PCB coolingXILINX INC·Filed 2021·Granted Feb 8, 2022·7 cites·20 claims
- 1394US8691626B2Semiconductor chip device with underfillSU MICHAEL Z·Filed 2010·Granted Apr 8, 2014·24 cites·21 claims
- 1494US8472190B2Stacked semiconductor chip device with thermal managementREFAI-AHMED GAMAL·Filed 2010·Granted Jun 25, 2013·24 cites·24 claims
- 1594US7965511B2Cross-flow thermal management device and method of manufacture thereofATI TECHNOLOGIES ULC·Filed 2006·Granted Jun 21, 2011·29 cites·15 claims
- 1693US8804331B2Portable computing device with thermal managementREFAI-AHMED GAMAL·Filed 2011·Granted Aug 12, 2014·16 cites·19 claims
- 1793US8338961B2Semiconductor chip with reinforcing through-silicon-viasSU MICHAEL Z·Filed 2012·Granted Dec 25, 2012·15 cites·21 claims
- 1892US10147664B2Dynamic mounting thermal management for devices on boardXILINX INC·Filed 2017·Granted Dec 4, 2018·10 cites·24 claims
- 1992US9793191B2Heat spreader with flexible tolerance mechanismGEN ELECTRIC·Filed 2016·Granted Oct 17, 2017·7 cites·20 claims
- 2092US9668334B2Thermal clamp apparatus for electronic systemsGEN ELECTRIC·Filed 2014·Granted May 30, 2017·14 cites·20 claims
- 2191US11605886B1Radome with integrated passive coolingXILINX INC·Filed 2020·Granted Mar 14, 2023·4 cites·21 claims
- 2291US11328976B1Three-dimensional thermal management apparatuses for electronic devicesXILINX INC·Filed 2020·Granted May 10, 2022·3 cites·10 claims
- 2391US8866276B2Semiconductor chip device with polymeric filler trenchSU MICHAEL Z·Filed 2013·Granted Oct 21, 2014·11 cites·20 claims
- 2491US8034662B2Thermal interface material with support structureADVANCED MICRO DEVICES INC·Filed 2009·Granted Oct 11, 2011·20 cites·19 claims
- 2591US7964951B2Multi-die semiconductor package with heat spreaderATI TECHNOLOGIES ULC·Filed 2009·Granted Jun 21, 2011·21 cites·19 claims
- 2690US9437561B2Semiconductor chip with redundant thru-silicon-viasBLACK BRYAN·Filed 2010·Granted Sep 6, 2016·12 cites·17 claims
- 2790US9385055B2Stacked semiconductor chips with thermal managementREFAI-AHMED GAMAL·Filed 2010·Granted Jul 5, 2016·13 cites·17 claims
- 2889US11476556B1Remote active cooling heat exchanger and antenna system with the sameXILINX INC·Filed 2020·Granted Oct 18, 2022·2 cites·20 claims
- 2989US9947560B1Integrated circuit package, and methods and tools for fabricating the sameXILINX INC·Filed 2016·Granted Apr 17, 2018·7 cites·7 claims
- 3089US7623349B2Thermal management apparatus and method for a circuit substrateATI TECHNOLOGIES ULC·Filed 2005·Granted Nov 24, 2009·32 cites·15 claims
- 3188US12414226B2Electronic device with below PCB thermal managementADVANCED MICRO DEVICES INC·Filed 2023·Granted Sep 9, 2025·1 cites·20 claims
- 3288US10720377B2Electronic device apparatus with multiple thermally conductive paths for heat dissipationXILINX INC·Filed 2018·Granted Jul 21, 2020·6 cites·20 claims
- 3388US8058724B2Holistic thermal management system for a semiconductor chipREFAI-AHMED GAMAL·Filed 2007·Granted Nov 15, 2011·17 cites·7 claims
- 3487US7911791B2Heat sink for a circuit deviceATI TECHNOLOGIES ULC·Filed 2009·Granted Mar 22, 2011·15 cites·27 claims
- 3585US10629512B2Integrated circuit die with in-chip heat sinkXILINX INC·Filed 2018·Granted Apr 21, 2020·4 cites·20 claims
- 3685US8574965B2Semiconductor chip device with liquid thermal interface materialREFAI-AHMED GAMAL·Filed 2010·Granted Nov 5, 2013·8 cites·23 claims
- 3783US10054575B2Hydrogen detector and hydrogen detection methodGEN ELECTRIC·Filed 2015·Granted Aug 21, 2018·2 cites·20 claims
- 3882US7974096B2Three-dimensional thermal spreading in an air-cooled thermal deviceATI TECHNOLOGIES ULC·Filed 2006·Granted Jul 5, 2011·9 cites·5 claims
- 3982US7283364B2Thermal management apparatusATI TECHNOLOGIES INC·Filed 2004·Granted Oct 16, 2007·47 cites·13 claims
- 4081US8394672B2Method of manufacturing and assembling semiconductor chips with offset padsSU MICHAEL Z·Filed 2010·Granted Mar 12, 2013·5 cites·14 claims
- 4181US6915036B2Field reconfigurable line cards for an optical transport systemPTS CORP·Filed 2002·Granted Jul 5, 2005·19 cites·2 claims
- 4280US10085363B2Integrated compact impingement on extended heat surfaceGEN ELECTRIC·Filed 2014·Granted Sep 25, 2018·7 cites·15 claims
- 4379US7570490B2Variable spring rate thermal management apparatus attachment mechanismATI TECHNOLOGIES ULC·Filed 2005·Granted Aug 4, 2009·11 cites·26 claims
- 4478US11488936B2Stacked silicon package assembly having vertical thermal managementXILINX INC·Filed 2019·Granted Nov 1, 2022·2 cites·20 claims
- 4578US8796842B2Stacked semiconductor chip device with thermal management circuit boardREFAI-AHMED GAMAL·Filed 2010·Granted Aug 5, 2014·5 cites·25 claims
- 4678US7362583B2Thermal management device for multiple heat producing devicesATI TECHNOLOGIES INC·Filed 2005·Granted Apr 22, 2008·8 cites·18 claims
- 4776US9879661B2Vibrational fluid mover jet with active damping mechanismGEN ELECTRIC·Filed 2014·Granted Jan 30, 2018·4 cites·19 claims
- 4876US7584622B2Localized refrigerator apparatus for a thermal management deviceATI TECHNOLOGIES·Filed 2005·Granted Sep 8, 2009·5 cites·27 claims
- 4975US12094853B2Semiconductor chip with redundant thru-silicon-viasADVANCED MICRO DEVICES INC·Filed 2022·Granted Sep 17, 2024·0 cites·20 claims
- 5075US8617926B2Semiconductor chip device with polymeric filler trenchSU MICHAEL Z·Filed 2010·Granted Dec 31, 2013·3 cites·23 claims
Showing the top 50 of 85 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Gamal Refai-Ahmed files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →