Inventor · disambiguated record
Gaku Sudo
Also filed as: SUDO GAKU
33 granted patents·5 pending applications·204 citations·filing 2005–2022
96Inventor score
Top patents by PatentIndex Score
38 records- 0197US8835268B2Method for manufacturing semiconductor deviceSUDO GAKU·Filed 2012·Granted Sep 16, 2014·45 cites·14 claims
- 0294US7585720B2Dual stress liner device and methodTOSHIBA AMERICA ELECTRONIC·Filed 2006·Granted Sep 8, 2009·31 cites·20 claims
- 0393US8592890B2Semiconductor memory device and method for manufacturing sameWATANABE NOBUTAKA·Filed 2011·Granted Nov 26, 2013·22 cites·15 claims
- 0491US10985209B2Nonvolatile storage deviceTOSHIBA MEMORY CORP·Filed 2019·Granted Apr 20, 2021·3 cites·10 claims
- 0591US8658504B2Method for manufacturing semiconductor deviceSUDO GAKU·Filed 2012·Granted Feb 25, 2014·13 cites·15 claims
- 0690US9142537B2Integrated circuit device and method for manufacturing sameTOSHIBA KK·Filed 2014·Granted Sep 22, 2015·8 cites·5 claims
- 0787US8866206B2Integrated circuit device and method for manufacturing sameSUDO GAKU·Filed 2012·Granted Oct 21, 2014·7 cites·9 claims
- 0886US9997526B2Semiconductor device and method for manufacturing sameTOSHIBA MEMORY CORP·Filed 2016·Granted Jun 12, 2018·5 cites·6 claims
- 0982US8659159B2Integrated circuit device with interconnects arranged parallel to each other and connected to contact via, and method for manufacturing sameSUDO GAKU·Filed 2011·Granted Feb 25, 2014·4 cites·1 claims
- 1082US7569888B2Semiconductor device with close stress liner film and method of manufacturing the sameTOSHIBA AMERICA ELECTRONIC·Filed 2005·Granted Aug 4, 2009·8 cites·20 claims
- 1181US9831270B2Nonvolatile semiconductor memory device and method for manufacturing the sameTOSHIBA KK·Filed 2017·Granted Nov 28, 2017·3 cites·12 claims
- 1281US7402885B2LOCOS on SOI and HOT semiconductor device and method for manufacturingTOSHIBA AMERICA ELECTRONIC·Filed 2006·Granted Jul 22, 2008·9 cites·16 claims
- 1380US7727834B2Contact configuration and method in dual-stress liner semiconductor deviceTOSHIBA AMERICA ELECTRONIC·Filed 2008·Granted Jun 1, 2010·9 cites·5 claims
- 1479US8785325B2Method of manufacturing semiconductor deviceSUDO GAKU·Filed 2011·Granted Jul 22, 2014·4 cites·18 claims
- 1577US11856791B2Nonvolatile storage deviceKIOXIA CORP·Filed 2022·Granted Dec 26, 2023·0 cites·10 claims
- 1677US8154050B2Semiconductor device with semiconductor epitaxial layers buried in source/drain regions, and fabrication method of the sameSUDO GAKU·Filed 2008·Granted Apr 10, 2012·7 cites·6 claims
- 1775US9178064B2Method for manufacturing fin semiconductor device using dual masking layersSUDO GAKU·Filed 2012·Granted Nov 3, 2015·4 cites·20 claims
- 1874US7592653B2Stress relaxation for top of transistor gateTOSHIBA AMERICA ELECTRONIC·Filed 2006·Granted Sep 22, 2009·4 cites·4 claims
- 1973US8004035B2Dual stress liner device and methodTOSHIBA KK·Filed 2009·Granted Aug 23, 2011·4 cites·7 claims
- 2071US11367748B2Nonvolatile storage deviceKIOXIA CORP·Filed 2021·Granted Jun 21, 2022·0 cites·8 claims
- 2170US8129790B2HOT process STI in SRAM device and method of manufacturingSUDO GAKU·Filed 2009·Granted Mar 6, 2012·3 cites·3 claims
- 2269US8614138B2Manufacturing method of semiconductor deviceSUDO GAKU·Filed 2012·Granted Dec 24, 2013·2 cites·12 claims
- 2368US9117888B2Integrated circuit device and method for manufacturing sameTOSHIBA KK·Filed 2014·Granted Aug 25, 2015·1 cites·4 claims
- 2467US8790979B2Semiconductor device and method for manufacturing sameTOSHIBA KK·Filed 2013·Granted Jul 29, 2014·2 cites·16 claims
- 2563US10283647B2Semiconductor deviceTOSHIBA MEMORY CORP·Filed 2017·Granted May 7, 2019·2 cites·20 claims
- 2662US10090320B2Semiconductor device and method for manufacturing the sameTOSHIBA MEMORY CORP·Filed 2016·Granted Oct 2, 2018·1 cites·20 claims
- 2762US8168520B2Method of manufacturing semiconductor deviceSUDO GAKU·Filed 2009·Granted May 1, 2012·1 cites·18 claims
- 2861US9384829B2Memory deviceTOSHIBA KK·Filed 2013·Granted Jul 5, 2016·2 cites·8 claims
- 2957US8816502B2Integrated circuit device and method for manufacturing sameTOSHIBA KK·Filed 2013·Granted Aug 26, 2014·0 cites·10 claims
- 3057US7960769B2Solid-state imaging device and method for manufacturing sameTOSHIBA KK·Filed 2009·Granted Jun 14, 2011·0 cites·20 claims
- 3150US8153501B2Maskless selective boron-doped epitaxial growthSUDO GAKU·Filed 2009·Granted Apr 10, 2012·0 cites·16 claims
- 3246US7867893B2Method of forming an SOI substrate contactIBM·Filed 2007·Granted Jan 11, 2011·0 cites·15 claims
- 3343US2008124847A1Reducing Crystal Defects from Hybrid Orientation Technology During Semiconductor ManufactureTOSHIBA AMERICA ELECTRONIC·Filed 2006·Application pending·0 cites
- 3443US2008251842A1P-Channel FET Whose Hole Mobility is Improved by Applying Stress to the Channel Region and a Method of Manufacturing the SameSUDO GAKU·Filed 2008·Application pending·0 cites
- 3542US2009032843A1Semiconductor device and method for manufacturing the sameOHTA ATSUSHI·Filed 2008·Application pending·0 cites
- 3640US8860104B2Semiconductor device and method for manufacturing sameSUDO GAKU·Filed 2012·Granted Oct 14, 2014·0 cites·4 claims
- 3739US2014021555A1Manufacturing method of semiconductor device and semiconductor deviceTOSHIBA KK·Filed 2013·Application pending·0 cites
- 3839US2007249112A1Differential spacer formation for a field effect transistorTOSHIBA CORP SEMICONDUCTOR COM·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →