Inventor · disambiguated record
Gary Williams
Also filed as: WILLIAMS GARY · WILLIAMS GARY W · WILLIAMS GARY WAYNE
37 granted patents·1 pending application·734 citations·filing 1998–2011
98Inventor score
Files withHEWLETT PACKARD DEVELOPMENT CO30ORNBERG RICHARD L2INFINEON TECHNOLOGIES AG1INFINEON TECHNOLOGIES CORP1
Top patents by PatentIndex Score
38 records- 0197US7791889B2Redundant power beneath circuit boardHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Sep 7, 2010·118 cites·12 claims
- 0294US7499281B2Multi-chip module with power systemHEWLETT PACKARD DEVELOPMENT CO·Filed 2008·Granted Mar 3, 2009·35 cites·8 claims
- 0394US7360104B2Redundant voltage distribution system and method for a memory module having multiple external voltagesHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Apr 15, 2008·29 cites·35 claims
- 0492US6947286B2Stack up assemblyHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Sep 20, 2005·15 cites·20 claims
- 0591US6816378B1Stack up assemblyHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Nov 9, 2004·40 cites·38 claims
- 0689US7068515B2Multi-chip module with stacked redundant powerHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Jun 27, 2006·46 cites·20 claims
- 0789US6771507B1Power module for multi-chip printed circuit boardsHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Aug 3, 2004·55 cites·7 claims
- 0887US7345885B2Heat spreader with multiple stacked printed circuit boardsHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Mar 18, 2008·38 cites·18 claims
- 0986US7336490B2Multi-chip module with power systemHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Feb 26, 2008·38 cites·11 claims
- 1086US7313706B2System and method for managing power consumption for a plurality of processors based on a supply voltage to each processor, temperature, total power consumption and individual processor power consumptionHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Dec 25, 2007·48 cites·12 claims
- 1180US7280365B2Multi-processor module with redundant powerHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Oct 9, 2007·9 cites·20 claims
- 1279US7072185B1Electronic module for system board with pass-thru holesHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Jul 4, 2006·27 cites·13 claims
- 1374US6263604B1Hermetically scaled picture frameFiled 1999·Granted Jul 24, 2001·28 cites·3 claims
- 1473US7475175B2Multi-processor moduleHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Jan 6, 2009·19 cites·40 claims
- 1572US7851945B2System and method of providing powerHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Dec 14, 2010·9 cites·12 claims
- 1672US7289328B2Multi-chip module with power system and pass-thru holesHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Oct 30, 2007·16 cites·19 claims
- 1772US6862186B2Stack up assemblyHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Mar 1, 2005·10 cites·11 claims
- 1871US6900987B2Stack up assemblyHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted May 31, 2005·9 cites·25 claims
- 1971US6873530B2Stack up assemblyHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Mar 29, 2005·9 cites·16 claims
- 2070US7649404B2Independent thresholds for power supply control circuitryHEWLETT PACKARD DEVELOPMENT CO·Filed 2006·Granted Jan 19, 2010·11 cites·26 claims
- 2168US7280364B2Apparatus and method for multiprocessor circuit boardHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Oct 9, 2007·15 cites·20 claims
- 2268US7064955B2Redundant power for processor circuit boardHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Jun 20, 2006·15 cites·20 claims
- 2366US6922340B2Stack up assemblyHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Jul 26, 2005·7 cites·12 claims
- 2465US7327569B2Processor module with thermal dissipation deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Feb 5, 2008·12 cites·19 claims
- 2564US9241622B2Method for ocular surface imagingORNBERG RICHARD L·Filed 2011·Granted Jan 26, 2016·3 cites·14 claims
- 2664US7254027B2Processor module for system boardHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Aug 7, 2007·10 cites·20 claims
- 2759US6067748AMemorial vaseFiled 1998·Granted May 30, 2000·23 cites·1 claims
- 2858US9232889B2Method and apparatus for ocular surface imagingORNBERG RICHARD L·Filed 2010·Granted Jan 12, 2016·2 cites·19 claims
- 2952US7719809B2Method and apparatus for distributing electrical powerHEWLETT PACKARD DEVELOPMENT CO·Filed 2006·Granted May 18, 2010·2 cites·16 claims
- 3051US7082042B2System and method for power distributionHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Jul 25, 2006·8 cites·20 claims
- 3151US6969261B2Electrical connectorHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Nov 29, 2005·7 cites·26 claims
- 3250US6954002B2System and method of enhancing alignment marksINFINEON TECHNOLOGIES CORP·Filed 2002·Granted Oct 11, 2005·2 cites·10 claims
- 3346US7074051B2System and method for electrically interconnecting boardsHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Jul 11, 2006·4 cites·14 claims
- 3444US7030506B2Mask and method for using the mask in lithographic processingINFINEON TECHNOLOGIES AG·Filed 2003·Granted Apr 18, 2006·2 cites·21 claims
- 3540US7018215B2Routing systemHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Mar 28, 2006·1 cites·12 claims
- 3640US6105287AOutdoor display systemFiled 1998·Granted Aug 22, 2000·10 cites·9 claims
- 3738US7154754B2Modular voltage regulatorHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Dec 26, 2006·2 cites·19 claims
- 3834US2003003676A1Ultra-fine alignment system and method using acoustic-AFM interactionFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →