Inventor · disambiguated record
George Arrigotti
Also filed as: ARRIGOTTI GEORGE · ARRIGOTTI GEORGE L
10 granted patents·2 pending applications·157 citations·filing 1995–2004
90Inventor score
Files withINTEL CORP11
Top patents by PatentIndex Score
12 records- 0187US6734371B2Soldered heat sink anchor and method of useINTEL CORP·Filed 2001·Granted May 11, 2004·36 cites·24 claims
- 0278US7183496B2Soldered heat sink anchor and method of useINTEL CORP·Filed 2004·Granted Feb 27, 2007·18 cites·15 claims
- 0373US6801436B2Extension mechanism and method for assembling overhanging componentsINTEL CORP·Filed 2001·Granted Oct 5, 2004·14 cites·11 claims
- 0473US6764325B2Zero insertion force heat-activated retention pinINTEL CORP·Filed 2002·Granted Jul 20, 2004·17 cites·29 claims
- 0568US6791035B2Interposer to couple a microelectronic device package to a circuit boardINTEL CORP·Filed 2002·Granted Sep 14, 2004·11 cites·21 claims
- 0667US7251880B2Method and structure for identifying lead-free solderINTEL CORP·Filed 2001·Granted Aug 7, 2007·12 cites·29 claims
- 0761US5966020AMethod and apparatus for facilitating detection of solder opens of SMT componentsINTEL CORP·Filed 1996·Granted Oct 12, 1999·23 cites·26 claims
- 0854US6917524B2Extension mechanism and method for assembling overhanging componentsINTEL CORP·Filed 2004·Granted Jul 12, 2005·4 cites·13 claims
- 0954US5794007ASystem and method for programming programmable electronic components using board-level automated test equipmentINTEL CORP·Filed 1995·Granted Aug 11, 1998·19 cites·22 claims
- 1044US6817878B2Zero mounting force solder-free connector/component and methodINTEL CORP·Filed 2001·Granted Nov 16, 2004·3 cites·16 claims
- 1140US2004003496A1Interposer to couple a microelectronic device package to a circuit boardINTEL CORP·Filed 2003·Application pending·0 cites
- 1234US2004124006A1Built up landsFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →