Inventor · disambiguated record
Gerald K. Bartley
Also filed as: BARTLEY GERALD · BARTLEY GERALD K · BARTLEY GERALD KEITH
166 granted patents·26 pending applications·1,191 citations·filing 1996–2021
99Inventor score
Top patents by PatentIndex Score
192 records- 0198US8736068B2Hybrid bonding techniques for multi-layer semiconductor stacksBARTLEY GERALD K·Filed 2012·Granted May 27, 2014·215 cites·11 claims
- 0297US8299608B2Enhanced thermal management of 3-D stacked die packagingBARTLEY GERALD K·Filed 2010·Granted Oct 30, 2012·60 cites·23 claims
- 0395US9739825B2Residual material detection in backdrilled stubsIBM·Filed 2016·Granted Aug 22, 2017·6 cites·16 claims
- 0495US9495498B2Universal inter-layer interconnect for multi-layer semiconductor stacksBARTLEY GERALD K·Filed 2012·Granted Nov 15, 2016·19 cites·16 claims
- 0593US9488690B2Residual material detection in backdrilled stubsIBM·Filed 2014·Granted Nov 8, 2016·8 cites·10 claims
- 0693US9341670B2Residual material detection in backdrilled stubsIBM·Filed 2014·Granted May 17, 2016·13 cites·10 claims
- 0792US8445918B2Thermal enhancement for multi-layer semiconductor stacksBARTLEY GERALD K·Filed 2010·Granted May 21, 2013·17 cites·18 claims
- 0892US7342816B2Daisy chainable memory chipIBM·Filed 2006·Granted Mar 11, 2008·27 cites·20 claims
- 0991US8293578B2Hybrid bonding techniques for multi-layer semiconductor stacksBARTLEY GERALD K·Filed 2010·Granted Oct 23, 2012·11 cites·10 claims
- 1091US7496711B2Multi-level memory architecture with data prioritizationIBM·Filed 2006·Granted Feb 24, 2009·26 cites·19 claims
- 1190US9245813B2Horizontally aligned graphite nanofibers in etched silicon wafer troughs for enhanced thermal performanceIBM·Filed 2013·Granted Jan 26, 2016·13 cites·13 claims
- 1290US7309911B2Method and stacked memory structure for implementing enhanced cooling of memory devicesIBM·Filed 2005·Granted Dec 18, 2007·19 cites·19 claims
- 1389US9438606B1Environmental-based location monitoringIBM·Filed 2015·Granted Sep 6, 2016·5 cites·1 claims
- 1489US8492903B2Through silicon via direct FET signal gatingBARTLEY GERALD K·Filed 2011·Granted Jul 23, 2013·10 cites·10 claims
- 1589US7952478B2Capacitance-based microchip exploitation detectionIBM·Filed 2008·Granted May 31, 2011·20 cites·20 claims
- 1688US7884625B2Capacitance structures for defeating microchip tamperingIBM·Filed 2008·Granted Feb 8, 2011·16 cites·20 claims
- 1788US7254663B2Multi-node architecture with daisy chain communication link configurable to operate in unidirectional and bidirectional modesIBM·Filed 2004·Granted Aug 7, 2007·46 cites·11 claims
- 1886US10318462B2Secure crypto module including optical glass security layerIBM·Filed 2016·Granted Jun 11, 2019·4 cites·16 claims
- 1986US8140297B2Three dimensional chip fabricationBARTLEY GERALD K·Filed 2009·Granted Mar 20, 2012·12 cites·20 claims
- 2086US7989918B2Implementing tamper evident and resistant detection through modulation of capacitanceIBM·Filed 2009·Granted Aug 2, 2011·13 cites·20 claims
- 2185US11062039B2Secure hardware threat protectionIBM·Filed 2019·Granted Jul 13, 2021·3 cites·12 claims
- 2285US7707379B2Dynamic latency map for memory optimizationIBM·Filed 2007·Granted Apr 27, 2010·14 cites·18 claims
- 2384US10171498B2Secure crypto module including electrical shorting security layersIBM·Filed 2016·Granted Jan 1, 2019·3 cites·10 claims
- 2484US7723816B2Implementing decoupling capacitors with hot-spot thermal reduction on integrated circuit chipsIBM·Filed 2008·Granted May 25, 2010·10 cites·12 claims
- 2584US7202685B1Embedded probe-enabling socket with integral probe structuresIBM·Filed 2005·Granted Apr 10, 2007·12 cites·9 claims
- 2683US8642456B2Implementing semiconductor signal-capable capacitors with deep trench and TSV technologiesBARTLEY GERALD K·Filed 2012·Granted Feb 4, 2014·6 cites·8 claims
- 2783US8519304B2Implementing selective rework for chip stacks and silicon carrier assembliesBARTLEY GERALD KEITH·Filed 2010·Granted Aug 27, 2013·6 cites·9 claims
- 2883US7838336B2Method and structure for dispensing chip underfill through an opening in the chipIBM·Filed 2007·Granted Nov 23, 2010·10 cites·6 claims
- 2982US10157527B1Embossed printed circuit board for intrusion detectionIBM·Filed 2017·Granted Dec 18, 2018·3 cites·18 claims
- 3082US8466024B2Power domain controller with gated through silicon via having FET with horizontal channelBARTLEY GERALD K·Filed 2010·Granted Jun 18, 2013·6 cites·2 claims
- 3182US7675164B2Method and structure for connecting, stacking, and cooling chips on a flexible carrierIBM·Filed 2007·Granted Mar 9, 2010·10 cites·15 claims
- 3282US7533198B2Memory controller and method for handling DMA operations during a page copyIBM·Filed 2005·Granted May 12, 2009·10 cites·6 claims
- 3382US7345900B2Daisy chained memory systemIBM·Filed 2006·Granted Mar 18, 2008·13 cites·22 claims
- 3481US9111899B2Horizontally and vertically aligned graphite nanofibers thermal interface material for use in chip stacksBARTLEY GERALD K·Filed 2012·Granted Aug 18, 2015·5 cites·13 claims
- 3581US7074050B1Socket assembly with incorporated memory structureIBM·Filed 2005·Granted Jul 11, 2006·19 cites·14 claims
- 3680US11061846B2Secure crypto module including electrical shorting security layersIBM·Filed 2018·Granted Jul 13, 2021·2 cites·10 claims
- 3780US10025751B2Dynamic clock lane assignment for increased performance and securityIBM·Filed 2016·Granted Jul 17, 2018·2 cites·13 claims
- 3880US8823090B2Field-effect transistor and method of creating sameBARTLEY GERALD K·Filed 2011·Granted Sep 2, 2014·5 cites·11 claims
- 3980US7345901B2Computer system having daisy chained self timed memory chipsIBM·Filed 2006·Granted Mar 18, 2008·12 cites·20 claims
- 4079US10481496B2Forming conductive vias using a light guideIBM·Filed 2017·Granted Nov 19, 2019·2 cites·21 claims
- 4179US8367478B2Method and system for internal layer-layer thermal enhancementIBM·Filed 2011·Granted Feb 5, 2013·5 cites·20 claims
- 4279US7822936B2Memory chip for high capacity memory subsystem supporting replication of command dataIBM·Filed 2007·Granted Oct 26, 2010·9 cites·20 claims
- 4379US7701244B2False connection for defeating microchip exploitationIBM·Filed 2008·Granted Apr 20, 2010·8 cites·20 claims
- 4479US6084775AHeatsink and package structures with fusible release layerIBM·Filed 1998·Granted Jul 4, 2000·54 cites·35 claims
- 4577US7954081B2Implementing enhanced wiring capability for electronic laminate packagesIBM·Filed 2008·Granted May 31, 2011·6 cites·10 claims
- 4677US7873773B2Multi-node architecture with daisy chain communication link configurable to operate in unidirectional and bidirectional modesIBM·Filed 2007·Granted Jan 18, 2011·7 cites·21 claims
- 4776US9310827B2Multiple active vertically aligned cores for three-dimensional chip stackIBM·Filed 2014·Granted Apr 12, 2016·3 cites·9 claims
- 4876US7809913B2Memory chip for high capacity memory subsystem supporting multiple speed busIBM·Filed 2007·Granted Oct 5, 2010·7 cites·10 claims
- 4976US7783793B2Handling DMA operations during a page copyIBM·Filed 2008·Granted Aug 24, 2010·6 cites·8 claims
- 5076US7088200B2Method and structure to control common mode impedance in fan-out regionsIBM·Filed 2004·Granted Aug 8, 2006·11 cites·13 claims
Showing the top 50 of 192 patent records by PatentIndex Score.
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