Inventor · disambiguated record
Gerhard Brehm
Also filed as: BREHM GERHARD
10 granted patents·365 citations·filing 1986–1996
92Inventor score
Top patents by PatentIndex Score
10 records- 0195US4739589AProcess and apparatus for abrasive machining of a wafer-like workpieceWACKER CHEMITRONIC·Filed 1986·Granted Apr 26, 1988·107 cites·7 claims
- 0282US4968381AMethod of haze-free polishing for semiconductor wafersWACKER CHEMITRONIC·Filed 1988·Granted Nov 6, 1990·65 cites·8 claims
- 0382US4844047AProcess for sawing crystal rods or blocks into thin wafersWACKER CHEMITRONIC·Filed 1987·Granted Jul 4, 1989·32 cites·12 claims
- 0478US4973563AProcess for preserving the surface of silicon wafersWACKER CHEMITRONIC·Filed 1989·Granted Nov 27, 1990·49 cites·8 claims
- 0578US4971654AProcess and apparatus for etching semiconductor surfacesWACKER CHEMITRONIC·Filed 1988·Granted Nov 20, 1990·61 cites·9 claims
- 0663US4811722AProcess for sharpening cutting-off tools and cutting-off processWACKER CHEMITRONIC·Filed 1988·Granted Mar 14, 1989·18 cites·6 claims
- 0748US5030910AMethod and apparatus for slicing crystalline wafers aided by magnetic field monitoring meansWACKER CHEMITRONIC·Filed 1989·Granted Jul 9, 1991·11 cites·12 claims
- 0837US5710077AMethod for the generation of stacking-fault-induced damage on the back of semiconductor wafersWACKER SILTRONIC HALBLEITERMAT·Filed 1996·Granted Jan 20, 1998·8 cites·5 claims
- 0934US5164323AProcess for the surface treatment of semiconductor slicesWACKER CHEMITRONIC·Filed 1990·Granted Nov 17, 1992·7 cites·6 claims
- 1028US4900363AMethod and liquid preparation for removing residues of auxiliary sawing materials from wafersWACKER CHEMITRONIC·Filed 1988·Granted Feb 13, 1990·7 cites·16 claims
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