Inventor · disambiguated record
Georgios Dogiamis
Also filed as: DOGIAMIS GEORGIOS · DOGIAMIS GEORGIOS C
155 granted patents·63 pending applications·284 citations·filing 2015–2025
99Inventor score
Top patents by PatentIndex Score
218 records- 0197US11387200B2Microelectronic devices with high frequency communication modules having compound semiconductor devices integrated on a package fabricINTEL CORP·Filed 2020·Granted Jul 12, 2022·4 cites·20 claims
- 0296US9960849B1Channelization for dispersion limited waveguide communication channelsINTEL CORP·Filed 2016·Granted May 1, 2018·17 cites·19 claims
- 0395US10462578B2Piezoelectric contact microphone with mechanical interfaceINTEL CORP·Filed 2017·Granted Oct 29, 2019·40 cites·20 claims
- 0494US11050155B2Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systemsINTEL CORP·Filed 2016·Granted Jun 29, 2021·7 cites·20 claims
- 0594US10976822B2Systems, methods, and apparatuses for implementing increased human perception of haptic feedback systemsINTEL CORP·Filed 2016·Granted Apr 13, 2021·12 cites·25 claims
- 0694US10886606B2Microelectronic devices designed with flexible package substrates with distributed stacked antennas for high frequency communication systemsINTEL CORP·Filed 2016·Granted Jan 5, 2021·11 cites·20 claims
- 0794US9902152B2Piezoelectric package-integrated synthetic jet devicesINTEL CORP·Filed 2016·Granted Feb 27, 2018·5 cites·20 claims
- 0893US10964178B2Systems, methods and apparatuses for implementing increased human perception of haptic feedback systemsINTEL CORP·Filed 2016·Granted Mar 30, 2021·10 cites·26 claims
- 0993US10951248B1Radio frequency (RF) module with shared inductorINTEL CORP·Filed 2019·Granted Mar 16, 2021·9 cites·10 claims
- 1092US11476554B2Mmwave waveguide to waveguide connectors for automotive applicationsINTEL CORP·Filed 2017·Granted Oct 18, 2022·9 cites·25 claims
- 1192US11206008B2Hybrid filter architecture with integrated passives, acoustic wave resonators and hermetically sealed cavities between two resonator diesINTEL CORP·Filed 2017·Granted Dec 21, 2021·7 cites·25 claims
- 1292US10573608B2Microelectronic devices designed with high frequency communication devices including compound semiconductor devices integrated on a die fabric on packageINTEL CORP·Filed 2015·Granted Feb 25, 2020·9 cites·22 claims
- 1392US10439671B2Microelectronic devices designed with high frequency communication modules having steerable beamforming capabilityINTEL CORP·Filed 2015·Granted Oct 8, 2019·10 cites·20 claims
- 1492US10291283B2Tunable radio frequency systems using piezoelectric package-integrated switching devicesINTEL CORP·Filed 2016·Granted May 14, 2019·6 cites·22 claims
- 1592US10079668B2Waveguide communication with increased link data rateINTEL CORP·Filed 2016·Granted Sep 18, 2018·8 cites·24 claims
- 1690US10452571B2Microelectronic package communication using radio interfaces connected through waveguidesINTEL CORP·Filed 2015·Granted Oct 22, 2019·8 cites·16 claims
- 1789US12406962B2Power delivery through capacitor-dies in a multi-layered microelectronic assemblyINTEL CORP·Filed 2021·Granted Sep 2, 2025·2 cites·20 claims
- 1889US11316497B2Multi-filter dieINTEL CORP·Filed 2019·Granted Apr 26, 2022·4 cites·20 claims
- 1989US10887439B2Microelectronic devices designed with integrated antennas on a substrateINTEL CORP·Filed 2015·Granted Jan 5, 2021·5 cites·18 claims
- 2089US10410983B2Microelectronic devices designed with high frequency communication devices including compound semiconductor devices integrated on an inter die fabric on packageINTEL CORP·Filed 2015·Granted Sep 10, 2019·6 cites·20 claims
- 2188US10629551B2Microelectronic devices with high frequency communication modules having compound semiconductor devices integrated on a package fabricINTEL CORP·Filed 2015·Granted Apr 21, 2020·5 cites·19 claims
- 2287US11056765B2Microelectronic devices designed with foldable flexible substrates for high frequency communication modulesINTEL CORP·Filed 2016·Granted Jul 6, 2021·5 cites·17 claims
- 2386US10546835B2Microelectronic devices designed with efficient partitioning of high frequency communication devices integrated on a package fabricINTEL CORP·Filed 2015·Granted Jan 28, 2020·4 cites·16 claims
- 2486US9647636B1Piezoelectric package-integrated delay lines for radio frequency identification tagsINTEL CORP·Filed 2016·Granted May 9, 2017·4 cites·26 claims
- 2585US11538758B2Waveguide interconnect bridgesINTEL CORP·Filed 2018·Granted Dec 27, 2022·3 cites·17 claims
- 2685US11456721B2RF front end module including hybrid filter and active circuits in a single packageINTEL CORP·Filed 2017·Granted Sep 27, 2022·4 cites·28 claims
- 2785US11310907B2Microelectronic package with substrate-integrated componentsINTEL CORP·Filed 2019·Granted Apr 19, 2022·3 cites·13 claims
- 2885US2024266745A1Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systemsINTEL CORP·Filed 2024·Application pending·0 cites
- 2984US12266840B2Waveguide interconnects for semiconductor packages and related methodsINTEL CORP·Filed 2021·Granted Apr 1, 2025·1 cites·22 claims
- 3083US12155133B2Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systemsINTEL CORP·Filed 2023·Granted Nov 26, 2024·0 cites·20 claims
- 3181US11011470B1Microelectronic package with mold-integrated componentsINTEL CORP·Filed 2019·Granted May 18, 2021·2 cites·20 claims
- 3281US10263312B2Plurality of dielectric waveguides including dielectric waveguide cores for connecting first and second server boardsINTEL CORP·Filed 2016·Granted Apr 16, 2019·3 cites·22 claims
- 3381US10256521B2Waveguide connector with slot launcherINTEL CORP·Filed 2016·Granted Apr 9, 2019·3 cites·25 claims
- 3480US11784108B2Thermal management in integrated circuit packagesINTEL CORP·Filed 2019·Granted Oct 10, 2023·2 cites·20 claims
- 3580US11329359B2Dielectric waveguide including a dielectric material with cavities therein surrounded by a conductive coating forming a wall for the cavitiesINTEL CORP·Filed 2018·Granted May 10, 2022·2 cites·25 claims
- 3680US11264687B2Microelectronic assemblies comprising a package substrate portion integrated with a substrate integrated waveguide filterINTEL CORP·Filed 2018·Granted Mar 1, 2022·2 cites·25 claims
- 3780US10594029B2Actuatable and adaptable metamaterials integrated in packageINTEL CORP·Filed 2016·Granted Mar 17, 2020·3 cites·22 claims
- 3880US10461388B2Millimeter wave fabric network over dielectric waveguidesINTEL CORP·Filed 2016·Granted Oct 29, 2019·3 cites·29 claims
- 3980US2024429588A1Millimeter-wave dielectric waveguide bundle including first and second adjacent dielectric waveguides having different core and/or cladding materialsINTEL CORP·Filed 2024·Application pending·0 cites
- 4079US11984439B2Microelectronic assembliesINTEL CORP·Filed 2018·Granted May 14, 2024·2 cites·17 claims
- 4179US11830787B2Thermal management in integrated circuit packagesINTEL CORP·Filed 2019·Granted Nov 28, 2023·2 cites·31 claims
- 4279US11716826B2Platforms including microelectronic packages therein coupled to a chassis, where waveguides couple the microelectronic packages to each other and usable in a computing deviceINTEL CORP·Filed 2019·Granted Aug 1, 2023·2 cites·19 claims
- 4379US11223524B2Package integrated security featuresINTEL CORP·Filed 2018·Granted Jan 11, 2022·2 cites·12 claims
- 4479US10992016B2Multiplexer and combiner structures embedded in a mmwave connector interfaceINTEL CORP·Filed 2017·Granted Apr 27, 2021·2 cites·24 claims
- 4579US10903818B2Piezoelectric package-integrated film bulk acoustic resonator devicesINTEL CORP·Filed 2016·Granted Jan 26, 2021·3 cites·26 claims
- 4679US10211970B2Millimeter wave CMOS engines for waveguide fabricsINTEL CORP·Filed 2017·Granted Feb 19, 2019·3 cites·25 claims
- 4778US11251512B2Pluggable MM-wave module for rack scale architecture (RSA) servers and high performance computers (HPCS)INTEL CORP·Filed 2017·Granted Feb 15, 2022·4 cites·25 claims
- 4877US12261097B2Thermal management in integrated circuit packagesINTEL CORP·Filed 2023·Granted Mar 25, 2025·0 cites·20 claims
- 4976US11335651B2Microelectronic devices designed with compound semiconductor devices and integrated on an inter die fabricINTEL CORP·Filed 2015·Granted May 17, 2022·2 cites·14 claims
- 5075US12327795B2Waveguide interconnect bridgesINTEL CORP·Filed 2022·Granted Jun 10, 2025·0 cites·22 claims
Showing the top 50 of 218 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →