Inventor · disambiguated record
Gerald K. Fehr
Also filed as: FEHR GERALD K
7 granted patents·2 pending applications·100 citations·filing 1994–2002
86Inventor score
Files withINTEGRATED PACKAGING ASSEMBLY3FORD MOTOR CO1INT PACKAGING AND ASSEMBLY COR1IPAC INC1OSE USA1
Top patents by PatentIndex Score
9 records- 0160US5682673AMethod for forming encapsulated IC packagesIPAC INC·Filed 1995·Granted Nov 4, 1997·30 cites·12 claims
- 0256US6498394B1IC packages with diamond substrate thermal conductorOSE USA·Filed 2000·Granted Dec 24, 2002·9 cites·1 claims
- 0354US5436407AMetal semiconductor package with an external plastic sealINTEGRATED PACKAGING ASSEMBLY·Filed 1994·Granted Jul 25, 1995·21 cites·14 claims
- 0444US6058602AMethod for encapsulating IC packages with diamond substrateINTEGRATED PACKAGING ASSEMBLY·Filed 1998·Granted May 9, 2000·11 cites·6 claims
- 0543US5859477AApparatus for encapsulating IC packages with diamond substrate thermal conductorINT PACKAGING AND ASSEMBLY COR·Filed 1997·Granted Jan 12, 1999·13 cites·9 claims
- 0635US5491110AMetal semiconductor package with an external plastic sealINTEGRATED PACKAGING ASSEMBLY·Filed 1995·Granted Feb 13, 1996·6 cites·13 claims
- 0734US5817941AMethod and apparatus for supporting a sensor in a vehicleFORD MOTOR CO·Filed 1997·Granted Oct 6, 1998·10 cites·12 claims
- 0832US2002089041A1Lead-frame design modification to facilitate removal of resist tape from the lead-frameFiled 2001·Application pending·0 cites
- 0931US2004067606A1Method for stack-packaging integrated circuit die using at least one die in the package as a spacerFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →