Inventor · disambiguated record

Gene Jospeh Gaudenzi

Also filed as: GAUDENZI GENE J · GAUDENZI GENE JOSPEH

1 granted patent·1 pending application·49 citations·filing 1997–1997

48Inventor score

Technology areasH10W Y10T

Files withIBM1

Top patents by PatentIndex Score

2 records

0172US6259159B1Reflowed solder ball with low melting point metal capIBM·Filed 1997·Granted Jul 10, 2001·49 cites·17 claims
0230US2001013423A1Flip chip attach on flexible circuit carrier using chip with metallic cap on solderFiled 1997·Application pending·0 cites

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