Inventor · disambiguated record
George Grama
Also filed as: GRAMA GEORGE · GRAMA GEORGE V
16 granted patents·2 pending applications·336 citations·filing 1997–2023
92Inventor score
Top patents by PatentIndex Score
18 records- 0197US7596849B1Method of assembling a wafer-level package filterTRIQUINT SEMICONDUCTOR INC·Filed 2007·Granted Oct 6, 2009·108 cites·29 claims
- 0295US7635636B2Wafer level packaging of materials with different coefficients of thermal expansionTRIQUINT SEMICONDUCTOR INC·Filed 2006·Granted Dec 22, 2009·92 cites·34 claims
- 0394US7109635B1Wafer level packaging of materials with different coefficients of thermal expansionSAWTEK INC·Filed 2004·Granted Sep 19, 2006·97 cites·26 claims
- 0493US11410937B2Semiconductor device with aluminum nitride anti-deflection layerRAYTHEON CO·Filed 2020·Granted Aug 9, 2022·3 cites·20 claims
- 0588US10515905B1Semiconductor device with anti-deflection layersRAYTHEON CO·Filed 2018·Granted Dec 24, 2019·5 cites·21 claims
- 0677US9209380B2Acoustic wave deviceTRIQUINT SEMICONDUCTOR INC·Filed 2013·Granted Dec 8, 2015·5 cites·9 claims
- 0773US12051712B2Close butted collocated variable technology imaging arrays on a single ROICRAYTHEON CO·Filed 2023·Granted Jul 30, 2024·0 cites·12 claims
- 0869US7800281B1Acoustic wave filters using photo-definable epoxy for suppression of unwanted acoustic energyTRIQUINT SEMICONDUCTOR INC·Filed 2008·Granted Sep 21, 2010·6 cites·11 claims
- 0964US11705471B2Close butted collocated variable technology imaging arrays on a single ROICRAYTHEON CO·Filed 2020·Granted Jul 18, 2023·0 cites·12 claims
- 1063US11851785B2Aluminum nitride passivation layer for mercury cadmium telluride in an electrical deviceRAYTHEON CO·Filed 2021·Granted Dec 26, 2023·0 cites·20 claims
- 1160US11222813B2Method of manufacturing wafer level low melting temperature interconnectionsRAYTHEON CO·Filed 2019·Granted Jan 11, 2022·0 cites·17 claims
- 1259US11710756B2Integrating optical elements with electro-optical sensors via direct-bond hybridizationRAYTHEON CO·Filed 2020·Granted Jul 25, 2023·0 cites·19 claims
- 1354US10504777B2Method of manufacturing wafer level low melting temperature interconnectionsRAYTHEON CO·Filed 2018·Granted Dec 10, 2019·0 cites·17 claims
- 1453US5874848AElectric current sensor utilizing a compensating trace configurationBELL TECHNOLOGIES INC·Filed 1997·Granted Feb 23, 1999·20 cites·10 claims
- 1539US11101130B2Method of filling grooves and holes in a substrateRAYTHEON CO·Filed 2019·Granted Aug 24, 2021·0 cites·25 claims
- 1635US9166548B1Acoustic wave filter manufacturing method using photo-definable epoxy for suppression of unwanted acoustic energyGRAMA GEORGE·Filed 2010·Granted Oct 20, 2015·0 cites·20 claims
- 1731US2013087379A1High reliability wafer level package and manufacturing methodGRAMA GEORGE·Filed 2011·Application pending·0 cites
- 1828US2012094418A1Wafer Level Package and Manufacturing Method Using Photodefinable Polymer for Enclosing Acoustic DevicesGRAMA GEORGE·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →