Inventor · disambiguated record
Gerhard Haubner
Also filed as: HAUBNER GERHARD
2 granted patents·1 pending application·0 citations·filing 2016–2024
22Inventor score
Files withINFINEON TECHNOLOGIES AG3
Top patents by PatentIndex Score
3 records- 0154US2025016918A1Printed circuit board and method for mounting at least one semiconductor chip deviceINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0241US10916484B2Electronic device including redistribution layer pad having a voidINFINEON TECHNOLOGIES AG·Filed 2018·Granted Feb 9, 2021·0 cites·21 claims
- 0330US10607911B2Chip carrier laminate with high frequency dielectric and thermomechanical bufferINFINEON TECHNOLOGIES AG·Filed 2016·Granted Mar 31, 2020·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →