Inventor · disambiguated record
Geunwoo Kim
Also filed as: KIM GEUNWOO
23 granted patents·13 pending applications·23 citations·filing 2015–2025
92Inventor score
Top patents by PatentIndex Score
36 records- 0194US11417656B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 16, 2022·3 cites·20 claims
- 0293US11631769B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 18, 2023·3 cites·17 claims
- 0391US10804158B2Methods of fabricating semiconductor devices including differing barrier layer structuresSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 13, 2020·3 cites·20 claims
- 0490US11955487B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Apr 9, 2024·1 cites·19 claims
- 0587US11239334B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 1, 2022·2 cites·19 claims
- 0683US11552392B2Electronic device including antenna moduleSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jan 10, 2023·5 cites·4 claims
- 0781US12183742B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Dec 31, 2024·0 cites·20 claims
- 0874US2025372500A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0971US10147616B2Package frame and method of manufacturing semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Dec 4, 2018·3 cites·17 claims
- 1070US11837645B2Method of manufacturing a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 5, 2023·0 cites·20 claims
- 1169US11538916B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 27, 2022·0 cites·20 claims
- 1268US11682706B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jun 20, 2023·0 cites·20 claims
- 1364US11830874B2Method of fabricating a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 28, 2023·0 cites·20 claims
- 1464US9881827B2Substrate treating apparatus and substrate treating methodKIM GEUNWOO·Filed 2015·Granted Jan 30, 2018·2 cites·19 claims
- 1562US12419086B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Sep 16, 2025·0 cites·20 claims
- 1662US12406917B2Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 2, 2025·0 cites·10 claims
- 1762US11233050B2Semiconductor device with diffusion barrier in the active contactSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jan 25, 2022·0 cites·20 claims
- 1862US2025079279A1Electronic device including a semiconductor package and a method of manufacturing the electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1961US2025125280A1Semiconductor package and semiconductor package manufacturing methodSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2061US2025226272A1Semiconductor package with a blocking element formed on a surface of an insulating layerSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2159US2025192029A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2258US2025107179A1Integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2358US2025096134A1Integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2457US2024234342A9Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2555US10593597B2Methods of fabricating semiconductor devices including differing barrier layer structuresSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Mar 17, 2020·0 cites·20 claims
- 2655US2024234287A9Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2754US2023135806A1Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 2853US2024145329A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2952US12230682B2Integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Feb 18, 2025·0 cites·20 claims
- 3052US10332755B2Package substrates and methods of fabricating the sameYOON Hyesun·Filed 2016·Granted Jun 25, 2019·1 cites·13 claims
- 3149US11469188B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 11, 2022·0 cites·20 claims
- 3249US2023178476A1Integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 3345US11668782B2Electronic apparatus, controlling method of electronic apparatus and computer readable mediumSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 6, 2023·0 cites·14 claims
- 3442US11405069B2Electronic device and method for transmitting uplink reference signalSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 2, 2022·0 cites·10 claims
- 3533US12126685B2Network connection method and electronic device supporting sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 22, 2024·0 cites·12 claims
- 3628US2016141746A1Electronic device including antennaSAMSUNG ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Geunwoo Kim files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →