Inventor · disambiguated record
Gentarou Masuda
Also filed as: MASUDA GENTAROU
1 granted patent·3 pending applications·0 citations·filing 2011–2025
14Inventor score
Files withDENSO CORP4
Top patents by PatentIndex Score
4 records- 0172US2025259902A1Semiconductor package, electronic device, and method for manufacturing semiconductor packageDENSO CORP·Filed 2025·Application pending·0 cites
- 0272US2025253198A1Semiconductor package, electronic device, and method for manufacturing semiconductor packageDENSO CORP·Filed 2025·Application pending·0 cites
- 0364US12400923B2Semiconductor package, electronic device, and method for manufacturing semiconductor packageDENSO CORP·Filed 2021·Granted Aug 26, 2025·0 cites·17 claims
- 0437US2011266033A1Multilayer boardDENSO CORP·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →