Inventor · disambiguated record
George P. Mcgill
Also filed as: MCGILL GEORGE P
4 granted patents·619 citations·filing 1990–1992
84Inventor score
Files withMICRON TECHNOLOGY INC4
Top patents by PatentIndex Score
4 records- 0195US5145099AMethod for combining die attach and lead bond in the assembly of a semiconductor packageMICRON TECHNOLOGY INC·Filed 1991·Granted Sep 8, 1992·225 cites·9 claims
- 0293US5140405ASemiconductor assembly utilizing elastomeric single axis conductive interconnectMICRON TECHNOLOGY INC·Filed 1991·Granted Aug 18, 1992·181 cites·15 claims
- 0388US5440241AMethod for testing, burning-in, and manufacturing wafer scale integrated circuits and a packaged wafer assembly produced therebyMICRON TECHNOLOGY INC·Filed 1992·Granted Aug 8, 1995·118 cites·5 claims
- 0485US5062565AMethod for combining die attach and wirebond in the assembly of a semiconductor packageMICRON TECHNOLOGY INC·Filed 1990·Granted Nov 5, 1991·95 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →