Inventor · disambiguated record
Geol Nam
Also filed as: NAM Geol
14 granted patents·1 pending application·45 citations·filing 2016–2024
90Inventor score
Top patents by PatentIndex Score
15 records- 0196US11894346B2Semiconductor package having a high reliabilitySAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Feb 6, 2024·2 cites·20 claims
- 0295US11018115B2Semiconductor package having a high reliabilitySAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 25, 2021·3 cites·19 claims
- 0395US10153255B2Semiconductor package having a high reliabilitySAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Dec 11, 2018·12 cites·19 claims
- 0493US11393764B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jul 19, 2022·7 cites·20 claims
- 0593US10431547B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Oct 1, 2019·9 cites·19 claims
- 0690US10622335B2Semiconductor package having a high reliabilitySAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Apr 14, 2020·4 cites·20 claims
- 0789US11848274B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 19, 2023·2 cites·20 claims
- 0887US11462479B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 4, 2022·4 cites·19 claims
- 0986US12183718B2Semiconductor package having a high reliabilitySAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Dec 31, 2024·0 cites·20 claims
- 1086US11664352B2Semiconductor package having a high reliabilitySAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 30, 2023·1 cites·20 claims
- 1171US10651154B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted May 12, 2020·1 cites·20 claims
- 1265US11705430B2Semiconductor package including mold layer having curved cross-section shapeSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 18, 2023·0 cites·15 claims
- 1355US10964670B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Mar 30, 2021·0 cites·12 claims
- 1446US2022246582A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Application pending·0 cites
- 1542US10090278B2Semiconductor packagesPARK SANG SICK·Filed 2016·Granted Oct 2, 2018·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →