Inventor · disambiguated record
Geunsik Oh
Also filed as: OH GEUNSIK
3 granted patents·1 pending application·10 citations·filing 2015–2024
56Inventor score
Files withSAMSUNG ELECTRONICS CO LTD4
Top patents by PatentIndex Score
4 records- 0188US9553069B2Bonding apparatus and substrate manufacturing equipment including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jan 24, 2017·10 cites·19 claims
- 0261US2025259866A1Device for removing void in underfill materialSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0347US11581202B2Substrate debonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 14, 2023·0 cites·20 claims
- 0441US11984344B2Lift apparatus and substrate processing apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 14, 2024·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →