Inventor · disambiguated record
Gerd Schlottig
Also filed as: SCHLOTTIG GERD
25 granted patents·6 pending applications·70 citations·filing 2012–2025
94Inventor score
Top patents by PatentIndex Score
31 records- 0194US8937810B2Electronic assembly with detachable coolant manifold and coolant-cooled electronic moduleBRUNSCHWILER THOMAS J·Filed 2012·Granted Jan 20, 2015·24 cites·16 claims
- 0292US9941189B2Counter-flow expanding channels for enhanced two-phase heat removalIBM·Filed 2015·Granted Apr 10, 2018·7 cites·24 claims
- 0388US10527365B1Disconnect assembly for active cooling of packaged electronicsIBM·Filed 2018·Granted Jan 7, 2020·4 cites·18 claims
- 0488US10006571B2Releasable, threadless conduit connector for liquid manifoldIBM·Filed 2014·Granted Jun 26, 2018·4 cites·14 claims
- 0587US10727159B2Counter-flow expanding channels for enhanced two-phase heat removalIBM·Filed 2019·Granted Jul 28, 2020·3 cites·20 claims
- 0687US10153250B2Flip-chip electronic device with carrier having heat dissipation elements free of solder maskIBM·Filed 2014·Granted Dec 11, 2018·6 cites·6 claims
- 0785US9433077B2Substrate device and electric circuit arrangement having first substrate section perpendicular to second substrate sectionIBM·Filed 2015·Granted Aug 30, 2016·5 cites·12 claims
- 0883US9066460B2Disassemblable electronic assembly with leak-inhibiting coolant capillariesIBM·Filed 2013·Granted Jun 23, 2015·6 cites·20 claims
- 0980US9698089B2Substrate device and electric circuit arrangement having first substrate section perpendicular to second substrate sectionIBM·Filed 2016·Granted Jul 4, 2017·4 cites·20 claims
- 1075US10388540B2High-performance compliant heat-exchanger comprising vapor chamberIBM·Filed 2017·Granted Aug 20, 2019·2 cites·15 claims
- 1175US10107426B2Releasable, threadless conduit connector for liquid manifoldIBM·Filed 2015·Granted Oct 23, 2018·1 cites·15 claims
- 1274US9864152B1Optical assembly with optical couplerIBM·Filed 2016·Granted Jan 9, 2018·2 cites·20 claims
- 1369US11251160B2Manufacturing of flip-chip electronic device with carrier having heat dissipation elements free of solder maskIBM·Filed 2020·Granted Feb 15, 2022·0 cites·11 claims
- 1467US10132433B2Releasable, threadless conduit connector for liquid manifoldIBM·Filed 2018·Granted Nov 20, 2018·0 cites·20 claims
- 1565US10767939B2Disconnect assembly for active cooling of packaged electronicsIBM·Filed 2019·Granted Sep 8, 2020·0 cites·19 claims
- 1664US10727158B2Counter-flow expanding channels for enhanced two-phase heat removalIBM·Filed 2019·Granted Jul 28, 2020·0 cites·20 claims
- 1762US8907503B2Manufacturing an underfill in a semiconductor chip packageIBM·Filed 2013·Granted Dec 9, 2014·1 cites·13 claims
- 1862US2025297898A1Method for an Electrical SystemABB SCHWEIZ AG·Filed 2025·Application pending·0 cites
- 1961US9397042B2Integrated helical multi-layer inductor structuresIBM·Filed 2014·Granted Jul 19, 2016·1 cites·9 claims
- 2059US10529648B2Counter-flow expanding channels for enhanced two-phase heat removalIBM·Filed 2018·Granted Jan 7, 2020·0 cites·20 claims
- 2159US2024384976A1Method to Detect a Size Change in an Energy Storage DeviceABB SCHWEIZ AG·Filed 2024·Application pending·0 cites
- 2258US10886254B2Flip-chip electronic device with carrier having heat dissipation elements free of solder maskIBM·Filed 2018·Granted Jan 5, 2021·0 cites·8 claims
- 2352US2024118333A1Diagnosis and prognosis of igbt modulesABB SCHWEIZ AG·Filed 2023·Application pending·0 cites
- 2452US2025020736A1Method for Estimating a Consumed Lifetime of an Energy Storage DeviceABB SCHWEIZ AG·Filed 2024·Application pending·0 cites
- 2549US9880595B2Cooling device with nested chambers for computer hardwareIBM·Filed 2016·Granted Jan 30, 2018·0 cites·18 claims
- 2648US10551132B2Heat removal element with thermal expansion coefficient mismatchIBM·Filed 2017·Granted Feb 4, 2020·0 cites·20 claims
- 2746US10157814B1Compliant heat sinkIBM·Filed 2017·Granted Dec 18, 2018·0 cites·16 claims
- 2846US9230832B2Method for manufacturing a filled cavity between a first and a second surfaceIBM·Filed 2014·Granted Jan 5, 2016·0 cites·14 claims
- 2941US2023048878A1Power Semiconductor Module with Accessible Metal ClipsHITACHI ENERGY SWITZERLAND AG·Filed 2021·Application pending·0 cites
- 3037US10763189B2Sealing arrangementIBM·Filed 2015·Granted Sep 1, 2020·0 cites·15 claims
- 3133US2017200659A1Porous underfill enabling reworkIBM·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →