Inventor · disambiguated record
Gerhard Schoor
Also filed as: SCHOOR GERHARD
4 granted patents·2 pending applications·30 citations·filing 2005–2007
72Inventor score
Top patents by PatentIndex Score
6 records- 0187US7344919B2Method for using gel package structure enhancing thermal dissipation between compressed printed circuit board and heat sink mechanical stiffenerIBM·Filed 2005·Granted Mar 18, 2008·15 cites·10 claims
- 0280US7543373B2Gel package structural enhancement of compression system board connectionsIBM·Filed 2005·Granted Jun 9, 2009·10 cites·11 claims
- 0368US7930820B2Method for structural enhancement of compression system board connectionsIBM·Filed 2005·Granted Apr 26, 2011·5 cites·13 claims
- 0449US2008089024A1Multi-Chip Module (MCM) of a Computer SystemIBM·Filed 2007·Application pending·0 cites
- 0543US2007072450A1Gel package structural enhancement of compression system board connectionsIBM·Filed 2005·Application pending·0 cites
- 0636US8929086B2Gel package structural enhancement of compression system board connectionsMCALLISTER MICHAEL F·Filed 2005·Granted Jan 6, 2015·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →