Inventor · disambiguated record
George Vakanas
Also filed as: VAKANAS GEORGE · VAKANAS GEORGE P
8 granted patents·2 pending applications·21 citations·filing 2001–2018
80Inventor score
Top patents by PatentIndex Score
10 records- 0180US7892883B2Clipless integrated heat spreader process and materialsINTEL CORP·Filed 2008·Granted Feb 22, 2011·9 cites·15 claims
- 0265US6878567B2Method and apparatus for fabrication of passivated microfluidic structures in semiconductor substratesINTEL CORP·Filed 2001·Granted Apr 12, 2005·9 cites·23 claims
- 0357US8426250B2Laser-assisted chemical singulation of a waferVAKANAS GEORGE·Filed 2008·Granted Apr 23, 2013·1 cites·19 claims
- 0446US7446382B2Method and apparatus for fabrication of passivated microfluidic structures in semiconductor substratesINTEL CORP·Filed 2004·Granted Nov 4, 2008·1 cites·20 claims
- 0544US11769753B2Thermally-optimized tunable stack in cavity package-on-packageINTEL CORP·Filed 2018·Granted Sep 26, 2023·0 cites·11 claims
- 0643US8173552B2Method of fabricating an identification mark utilizing a liquid film assisted by a laserVAKANAS GEORGE P·Filed 2009·Granted May 8, 2012·1 cites·13 claims
- 0740US2010129984A1Wafer singulation in high volume manufacturingVAKANAS GEORGE·Filed 2008·Application pending·0 cites
- 0839US2020098727A1Stacked wire-bond dice attached by pillars or bumps above a flip-chip die on a semiconductor package substrateMALLIK DEBENDRA·Filed 2018·Application pending·0 cites
- 0938US10066303B2Thin NiB or CoB capping layer for non-noble metallic bonding landing padsIMEC VZW·Filed 2015·Granted Sep 4, 2018·0 cites·15 claims
- 1038US8163598B2Clipless integrated heat spreader process and materialsKOSTIEW GEORGE·Filed 2011·Granted Apr 24, 2012·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →