Inventor · disambiguated record
Gi-Ho Cha
Also filed as: CHA GI-HO
7 granted patents·216 citations·filing 1995–2005
87Inventor score
Top patents by PatentIndex Score
7 records- 0189US5783022AApparatus and methods for wafer debonding using a liquid jetSAMSUNG ELECTRONICS CO LTD·Filed 1996·Granted Jul 21, 1998·110 cites·19 claims
- 0278US7582935B2Methods for manufacturing SOI substrate using wafer bonding and complementary high voltage bipolar transistor using the SOI substrateFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2005·Granted Sep 1, 2009·8 cites·25 claims
- 0372US5863375AApparatus and methods for wafer debonding using a liquid jetSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Jan 26, 1999·37 cites·6 claims
- 0471US6878605B2Methods for manufacturing SOI substrate using wafer bonding and complementary high voltage bipolar transistor using the SOI substrateFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2003·Granted Apr 12, 2005·16 cites·24 claims
- 0562US5665631ASOI substrate manufacturing methodSAMSUNG ELECTRONICS CO LTD·Filed 1995·Granted Sep 9, 1997·31 cites·12 claims
- 0641US6045892AMetal wiring structures for integrated circuits including seed layerSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Apr 4, 2000·10 cites·22 claims
- 0731US5746883AApparatus for bonding semiconductor wafersSAMSUNG ELECTRONICS CO LTD·Filed 1996·Granted May 5, 1998·4 cites·24 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →