Inventor · disambiguated record
Giulio Digiacomo
Also filed as: DIGIACOMO GIULIO
22 granted patents·925 citations·filing 1979–2001
97Inventor score
Files withIBM22
Top patents by PatentIndex Score
22 records- 0194US6281573B1Thermal enhancement approach using solder compositions in the liquid stateIBM·Filed 1998·Granted Aug 28, 2001·160 cites·16 claims
- 0293US6656770B2Thermal enhancement approach using solder compositions in the liquid stateIBM·Filed 2001·Granted Dec 2, 2003·74 cites·22 claims
- 0390US6085831ADirect chip-cooling through liquid vaporization heat exchangeIBM·Filed 1999·Granted Jul 11, 2000·115 cites·51 claims
- 0487US6281452B1Multi-level thin-film electronic packaging structure and related methodIBM·Filed 1998·Granted Aug 28, 2001·53 cites·21 claims
- 0586US6329721B1Pb-In-Sn tall C-4 for fatigue enhancementIBM·Filed 2000·Granted Dec 11, 2001·29 cites·6 claims
- 0686US6196443B1Pb-In-Sn tall C-4 for fatigue enhancementIBM·Filed 1998·Granted Mar 6, 2001·50 cites·8 claims
- 0782US5981310AMulti-chip heat-sink cap assemblyIBM·Filed 1998·Granted Nov 9, 1999·59 cites·11 claims
- 0880US6678949B2Process for forming a multi-level thin-film electronic packaging structureIBM·Filed 2001·Granted Jan 20, 2004·21 cites·8 claims
- 0980US5539186ATemperature controlled multi-layer moduleIBM·Filed 1992·Granted Jul 23, 1996·84 cites·13 claims
- 1080US5367195AStructure and method for a superbarrier to prevent diffusion between a noble and a non-noble metalIBM·Filed 1993·Granted Nov 22, 1994·58 cites·19 claims
- 1174US5420073AStructure and method for a superbarrier to prevent diffusion between a noble and a non-noble metalIBM·Filed 1994·Granted May 30, 1995·44 cites·17 claims
- 1271US5175609AStructure and method for corrosion and stress-resistant interconnecting metallurgyIBM·Filed 1991·Granted Dec 29, 1992·38 cites·14 claims
- 1370US6373133B1Multi-chip module and heat-sink cap combinationIBM·Filed 1999·Granted Apr 16, 2002·34 cites·15 claims
- 1468US5442239AStructure and method for corrosion and stress-resistant interconnecting metallurgyIBM·Filed 1992·Granted Aug 15, 1995·33 cites·36 claims
- 1565US4465223AProcess for brazingIBM·Filed 1983·Granted Aug 14, 1984·15 cites·3 claims
- 1664US6025649APb-In-Sn tall C-4 for fatigue enhancementIBM·Filed 1997·Granted Feb 15, 2000·19 cites·8 claims
- 1750US5266522AStructure and method for corrosion and stress-resistant interconnecting metallurgyIBM·Filed 1992·Granted Nov 30, 1993·18 cites·25 claims
- 1846US5831336ATernary solder for the enhancement of C-4 fatigue lifeIBM·Filed 1996·Granted Nov 3, 1998·10 cites·8 claims
- 1936US5192622ALow-cost ternary composite for use in vias in glass-ceramic structuresIBM·Filed 1991·Granted Mar 9, 1993·7 cites·7 claims
- 2034US5950907ATernary solder for the enhancement of C-4 fatigue lifeIBM·Filed 1997·Granted Sep 14, 1999·3 cites·5 claims
- 2129US4360289APin for brazing to a substrate and improved package resulting therefromIBM·Filed 1980·Granted Nov 23, 1982·1 cites·2 claims
- 2229US4272722ADetermination of electric current flow patternsIBM·Filed 1979·Granted Jun 9, 1981·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →