Inventor · disambiguated record
Gisela Lang
Also filed as: LANG GISELA
3 granted patents·41 citations·filing 1997–2000
71Inventor score
Files withSIEMENS AG3
Top patents by PatentIndex Score
3 records- 0173US6309953B1Process for producing a semiconductor device with a roughened semiconductor surfaceSIEMENS AG·Filed 2000·Granted Oct 30, 2001·19 cites·4 claims
- 0259US6140248AProcess for producing a semiconductor device with a roughened semiconductor surfaceSIEMENS AG·Filed 1997·Granted Oct 31, 2000·19 cites·4 claims
- 0322US6281031B1Method of severing a semiconductor waferSIEMENS AG·Filed 1999·Granted Aug 28, 2001·3 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →