Inventor · disambiguated record
Gi Sub Lee
Also filed as: LEE GI SUB
5 granted patents·2 citations·filing 2010–2021
63Inventor score
Top patents by PatentIndex Score
5 records- 0166US8822841B2Package substrate and fabricating method thereofLEE DONG GYU·Filed 2012·Granted Sep 2, 2014·2 cites·12 claims
- 0255US11670452B2Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2021·Granted Jun 6, 2023·0 cites·22 claims
- 0352US9142499B2Lead pin for package substrateSAMSUNG ELECTRO MECH·Filed 2014·Granted Sep 22, 2015·0 cites·17 claims
- 0447US11869718B2Multilayer capacitor and board having the same mounted thereonSAMSUNG ELECTRO MECH·Filed 2021·Granted Jan 9, 2024·0 cites·24 claims
- 0538US8766450B2Lead pin for package substrateLEE KI TAEK·Filed 2010·Granted Jul 1, 2014·0 cites·13 claims
Join the waitlist — get patent alerts
Get an alert when Gi Sub Lee files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →