Inventor · disambiguated record
Glenn J. Leedy
Also filed as: LEEDY GLENN · LEEDY GLENN J · LEEDY GLENN JOSEPH
82 granted patents·12 pending applications·11,240 citations·filing 1988–2018
99Inventor score
Files withELM TECHNOLOGY CORP41LEEDY GLENN J36TAIWAN SEMICONDUCTOR MFG5DRI TECHNOLOGY CORP1LEEDY GLENN1
Top patents by PatentIndex Score
94 records- 0199US8928119B2Three dimensional structure memoryLEEDY GLENN J·Filed 2009·Granted Jan 6, 2015·180 cites·67 claims
- 0299US7402897B2Vertical system integrationELM TECHNOLOGY CORP·Filed 2003·Granted Jul 22, 2008·349 cites·45 claims
- 0399US7242012B2Lithography device for semiconductor circuit pattern generatorELM TECHNOLOGY CORP·Filed 2003·Granted Jul 10, 2007·294 cites·82 claims
- 0499US6713327B2Stress controlled dielectric integrated circuit fabricationELM TECHNOLOGY CORP·Filed 2001·Granted Mar 30, 2004·154 cites·205 claims
- 0599US6551857B2Three dimensional structure integrated circuitsELM TECHNOLOGY CORP·Filed 2001·Granted Apr 22, 2003·210 cites·131 claims
- 0699US6208545B1Three dimensional structure memoryFiled 1997·Granted Mar 27, 2001·331 cites·28 claims
- 0799US6008126AMembrane dielectric isolation IC fabricationELM TECHNOLOGY CORP·Filed 1998·Granted Dec 28, 1999·431 cites·4 claims
- 0899US5915167AThree dimensional structure memoryELM TECHNOLOGY CORP·Filed 1997·Granted Jun 22, 1999·2.1k cites·73 claims
- 0999US5869354AMethod of making dielectrically isolated integrated circuitELM TECHNOLOGY CORP·Filed 1994·Granted Feb 9, 1999·146 cites·81 claims
- 1099US5592007AMembrane dielectric isolation transistor fabricationFiled 1995·Granted Jan 7, 1997·343 cites·7 claims
- 1199US5571741AMembrane dielectric isolation IC fabricationFiled 1995·Granted Nov 5, 1996·342 cites·3 claims
- 1299US5354695AMembrane dielectric isolation IC fabricationLEEDY GLENN J·Filed 1992·Granted Oct 11, 1994·419 cites·16 claims
- 1398US7474004B2Three dimensional structure memoryELM TECHNOLOGY CORP·Filed 2003·Granted Jan 6, 2009·89 cites·50 claims
- 1498US7193239B2Three dimensional structure integrated circuitELM TECHNOLOGY CORP·Filed 2003·Granted Mar 20, 2007·143 cites·79 claims
- 1598US7138295B2Method of information processing using three dimensional integrated circuitsELM TECHNOLOGY CORP·Filed 2003·Granted Nov 21, 2006·87 cites·220 claims
- 1698US6682981B2Stress controlled dielectric integrated circuit fabricationELM TECHNOLOGY CORP·Filed 2001·Granted Jan 27, 2004·77 cites·70 claims
- 1798US6563224B2Three dimensional structure integrated circuitELM TECHNOLOGY CORP·Filed 2002·Granted May 13, 2003·119 cites·4 claims
- 1898US6133640AThree-dimensional structure memoryELM TECHNOLOGY CORP·Filed 1997·Granted Oct 17, 2000·243 cites·36 claims
- 1998US5946559AMembrane dielectric isolation IC fabricationELM TECHNOLOGY CORP·Filed 1995·Granted Aug 31, 1999·292 cites·10 claims
- 2098US5840593AMembrane dielectric isolation IC fabricationELM TECHNOLOGY CORP·Filed 1997·Granted Nov 24, 1998·307 cites·2 claims
- 2198US5592018AMembrane dielectric isolation IC fabricationFiled 1995·Granted Jan 7, 1997·334 cites·13 claims
- 2298US5103557AMaking and testing an integrated circuit using high density probe pointsLEEDY GLENN J·Filed 1990·Granted Apr 14, 1992·430 cites·13 claims
- 2398US5020219AMethod of making a flexible tester surface for testing integrated circuitsLEEDY GLENN J·Filed 1989·Granted Jun 4, 1991·320 cites·27 claims
- 2498US4994735AFlexible tester surface for testing integrated circuitsLEEDY GLENN J·Filed 1989·Granted Feb 19, 1991·220 cites·14 claims
- 2597US8653672B2Three dimensional structure memoryLEEDY GLENN J·Filed 2010·Granted Feb 18, 2014·19 cites·169 claims
- 2697US7705466B2Three dimensional multi layer memory and control logic integrated circuit structureELM TECHNOLOGY CORP·Filed 2003·Granted Apr 27, 2010·84 cites·130 claims
- 2797US7670893B2Membrane IC fabricationTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Mar 2, 2010·42 cites·138 claims
- 2897US7615837B2Lithography device for semiconductor circuit pattern generationTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Nov 10, 2009·30 cites·24 claims
- 2997US7504732B2Three dimensional structure memoryELM TECHNOLOGY CORP·Filed 2002·Granted Mar 17, 2009·77 cites·68 claims
- 3097US6765279B2Membrane 3D IC fabricationELM TECHNOLOGY CORP·Filed 2001·Granted Jul 20, 2004·95 cites·15 claims
- 3197US6632706B1Three dimensional structure integrated circuit fabrication processELM TECHNOLOGY CORP·Filed 2000·Granted Oct 14, 2003·96 cites·35 claims
- 3297US5725995AMethod of repairing defective traces in an integrated circuit structureELM TECHNOLOGY CORP·Filed 1995·Granted Mar 10, 1998·177 cites·8 claims
- 3397US5654220AMethod of making a stacked 3D integrated circuit structureELM TECHNOLOGY CORP·Filed 1995·Granted Aug 5, 1997·165 cites·6 claims
- 3497US5633209AMethod of forming a circuit membrane with a polysilicon filmELM TECHNOLOGY CORP·Filed 1995·Granted May 27, 1997·89 cites·1 claims
- 3597US4924589AMethod of making and testing an integrated circuitLEEDY GLENN J·Filed 1988·Granted May 15, 1990·209 cites·20 claims
- 3696US8410617B2Three dimensional structure memoryLEEDY GLENN J·Filed 2009·Granted Apr 2, 2013·22 cites·62 claims
- 3796US8080442B2Vertical system integrationLEEDY GLENN J·Filed 2008·Granted Dec 20, 2011·21 cites·31 claims
- 3896US7911012B2Flexible and elastic dielectric integrated circuitTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Mar 22, 2011·19 cites·35 claims
- 3996US7485571B2Method of making an integrated circuitELM TECHNOLOGY CORP·Filed 2003·Granted Feb 3, 2009·36 cites·198 claims
- 4096US6294909B1Electro-magnetic lithographic alignment methodFiled 1995·Granted Sep 25, 2001·69 cites·12 claims
- 4196US6288561B1Method and apparatus for probing, testing, burn-in, repairing and programming of integrated circuits in a closed environment using a single apparatusELM TECHNOLOGY CORP·Filed 1995·Granted Sep 11, 2001·113 cites·86 claims
- 4296US5985693AHigh density three-dimensional IC interconnectionELM TECHNOLOGY CORP·Filed 1997·Granted Nov 16, 1999·218 cites·20 claims
- 4396US5034685ATest device for testing integrated circuitsLEEDY GLENN J·Filed 1989·Granted Jul 23, 1991·172 cites·14 claims
- 4495US7763948B2Flexible and elastic dielectric integrated circuitTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Jul 27, 2010·30 cites·57 claims
- 4595US6838896B2Method and system for probing, testing, burn-in, repairing and programming of integrated circuits in a closed environment using a single apparatusELM TECHNOLOGY CORP·Filed 2001·Granted Jan 4, 2005·54 cites·18 claims
- 4695US5629137AMethod of repairing an integrated circuit structureELM TECHNOLOGY CORP·Filed 1995·Granted May 13, 1997·121 cites·14 claims
- 4795US5580687AContact stepper printed lithography methodFiled 1995·Granted Dec 3, 1996·62 cites·16 claims
- 4895US5453404AMethod for making an interconnection structure for integrated circuitsFiled 1994·Granted Sep 26, 1995·159 cites·25 claims
- 4994US7479694B2Membrane 3D IC fabricationELM TECHNOLOGY CORP·Filed 2003·Granted Jan 20, 2009·28 cites·21 claims
- 5094US6020257AMembrane dielectric isolation IC fabricationELM TECHNOLOGY CORP·Filed 1997·Granted Feb 1, 2000·117 cites·16 claims
Showing the top 50 of 94 patent records by PatentIndex Score.
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