Inventor · disambiguated record
Gottfried Beer
Also filed as: BEER GOTTFRIED
87 granted patents·6 pending applications·906 citations·filing 1997–2020
99Inventor score
Files withINFINEON TECHNOLOGIES AG56BEER GOTTFRIED14BARTH HANS-JOACHIM4PRESSEL KLAUS4INTEL DEUTSCHLAND GMBH3
Top patents by PatentIndex Score
93 records- 0198US9978720B2Insulated dieINFINEON TECHNOLOGIES AG·Filed 2016·Granted May 22, 2018·39 cites·4 claims
- 0298US8952521B2Semiconductor packages with integrated antenna and method of forming thereofINFINEON TECHNOLOGIES AG·Filed 2013·Granted Feb 10, 2015·90 cites·28 claims
- 0398US7625781B2Semiconductor device having a plastic housing and external connections and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2006·Granted Dec 1, 2009·89 cites·10 claims
- 0496US10241088B2Photo-acoustic gas sensor module having light emitter and detector unitsINFINEON TECHNOLOGIES AG·Filed 2016·Granted Mar 26, 2019·13 cites·9 claims
- 0596US8866292B2Semiconductor packages with integrated antenna and methods of forming thereofBEER GOTTFRIED·Filed 2013·Granted Oct 21, 2014·65 cites·25 claims
- 0696US8237259B2Embedded chip packagePRESSEL KLAUS·Filed 2007·Granted Aug 7, 2012·46 cites·16 claims
- 0796US7858440B2Stacked semiconductor chipsINFINEON TECHNOLOGIES AG·Filed 2007·Granted Dec 28, 2010·44 cites·27 claims
- 0895US8779583B2Semiconductor device and manufacturing methodPRESSEL KLAUS·Filed 2012·Granted Jul 15, 2014·21 cites·20 claims
- 0995US8169059B2On-chip RF shields with through substrate conductorsBARTH HANS-JOACHIM·Filed 2008·Granted May 1, 2012·38 cites·42 claims
- 1094US8890284B2Semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2013·Granted Nov 18, 2014·17 cites·20 claims
- 1194US8216881B2Method for fabricating a semiconductor and semiconductor packageBEER GOTTFRIED·Filed 2010·Granted Jul 10, 2012·12 cites·9 claims
- 1294US8148257B1Semiconductor structure and method for making sameBARTH HANS-JOACHIM·Filed 2010·Granted Apr 3, 2012·24 cites·6 claims
- 1394US7692588B2Semiconductor module comprising components for microwave engineering in plastic casing and method for the production thereofINFINEON TECHNOLOGIES AG·Filed 2006·Granted Apr 6, 2010·41 cites·34 claims
- 1493US7048450B2Optoelectronic module with transmitter chip and connecting piece for the module with respect to an optical fiber and with respect to a circuit board, and methods for producing the sameINFINEON TECHNOLOGIES AG·Filed 2004·Granted May 23, 2006·62 cites·15 claims
- 1591US8258624B2Method for fabricating a semiconductor and semiconductor packageBEER GOTTFRIED·Filed 2007·Granted Sep 4, 2012·13 cites·7 claims
- 1690US7952185B2Semiconductor device with hollow structureINFINEON TECHNOLOGIES AG·Filed 2006·Granted May 31, 2011·17 cites·13 claims
- 1790US7936052B2On-chip RF shields with backside redistribution linesINFINEON TECHNOLOGIES AG·Filed 2008·Granted May 3, 2011·19 cites·19 claims
- 1889US7413353B2Device and method for data transmission between structural units connected by an articulated jointINFINEON TECHNOLOGIES AG·Filed 2007·Granted Aug 19, 2008·24 cites·31 claims
- 1987US9082644B2Method of manufacturing and testing a chip packageINFINEON TECHNOLOGIES AG·Filed 2013·Granted Jul 14, 2015·12 cites·22 claims
- 2085US8492200B2Method for fabricating a semiconductor and semiconductor packageBEER GOTTFRIED·Filed 2012·Granted Jul 23, 2013·4 cites·19 claims
- 2185US8338936B2Semiconductor device and manufacturing methodPRESSEL KLAUS·Filed 2008·Granted Dec 25, 2012·9 cites·19 claims
- 2283US10008470B2Embedded chip packages and methods for manufacturing an embedded chip packageINFINEON TECHNOLOGIES AG·Filed 2017·Granted Jun 26, 2018·3 cites·17 claims
- 2383US8552828B1System and method for a coreless transformerBEER GOTTFRIED·Filed 2012·Granted Oct 8, 2013·8 cites·34 claims
- 2483US8318540B2Method of manufacturing a semiconductor structureBEER GOTTFRIED·Filed 2008·Granted Nov 27, 2012·11 cites·6 claims
- 2581US10643971B2Method for fabricating a semiconductor and semiconductor packageINTEL DEUTSCHLAND GMBH·Filed 2019·Granted May 5, 2020·1 cites·20 claims
- 2681US8889548B2On-chip RF shields with backside redistribution linesBARTH HANS-JOACHIM·Filed 2011·Granted Nov 18, 2014·4 cites·29 claims
- 2781US8076784B2Stacked semiconductor chipsBRUNNBAUER MARKUS·Filed 2010·Granted Dec 13, 2011·5 cites·18 claims
- 2880US7729569B2Optical transmitter and/or receiver assembly comprising a planar optical circuitEZCONN CORP·Filed 2002·Granted Jun 1, 2010·22 cites·2 claims
- 2977US9196510B2Semiconductor package comprising two semiconductor modules and laterally extending connectorsINFINEON TECHNOLOGIES AG·Filed 2013·Granted Nov 24, 2015·4 cites·17 claims
- 3075US10211158B2Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power moduleINFINEON TECHNOLOGIES AG·Filed 2014·Granted Feb 19, 2019·3 cites·13 claims
- 3175US7863728B2Semiconductor module including components in plastic casingINFINEON TECHNOLOGIES AG·Filed 2007·Granted Jan 4, 2011·6 cites·17 claims
- 3275US7830026B2Semiconductor device with a plastic housing composition that includes filler particles and that at least partially embeds a semiconductor chipINFINEON TECHNOLOGIES AG·Filed 2006·Granted Nov 9, 2010·5 cites·15 claims
- 3374US10957671B2Method for fabricating a semiconductor and semiconductor packageINTEL DEUTSCHLAND GMBH·Filed 2020·Granted Mar 23, 2021·0 cites·16 claims
- 3474US10102967B2Method of manufacturing an inductor core for a chip assembly and chip assemblyINFINEON TECHNOLOGIES AG·Filed 2014·Granted Oct 16, 2018·3 cites·6 claims
- 3573US9859251B2Semiconductor device having a chip under packageINFINEON TECHNOLOGIES AG·Filed 2016·Granted Jan 2, 2018·2 cites·22 claims
- 3673US9589859B2Semiconductor arrangement, method for producing a number of chip assemblies and method for producing a semiconductor arrangementINFINEON TECHNOLOGIES AG·Filed 2014·Granted Mar 7, 2017·2 cites·12 claims
- 3773US9147585B2Method for fabricating a plurality of semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 2014·Granted Sep 29, 2015·2 cites·9 claims
- 3872US9496237B2Semiconductor device having solderable and bondable electrical contact padsINFINEON TECHNOLOGIES AG·Filed 2015·Granted Nov 15, 2016·2 cites·20 claims
- 3972US7807506B2Microelectromechanical semiconductor component with cavity structure and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2007·Granted Oct 5, 2010·4 cites·18 claims
- 4072US7759805B2Semiconductor device encapsulated by an electrically conductive plastic housing composition with conductive particlesINFINEON TECHNOLOGIES AG·Filed 2007·Granted Jul 20, 2010·4 cites·19 claims
- 4170US9721920B2Embedded chip packages and methods for manufacturing an embedded chip packageINFINEON TECHNOLOGIES AG·Filed 2013·Granted Aug 1, 2017·2 cites·22 claims
- 4270US8330274B2Semiconductor structure and method for making sameBARTH HANS-JOACHIM·Filed 2010·Granted Dec 11, 2012·2 cites·17 claims
- 4370US7268423B2Flexible rewiring plate for semiconductor components, and process for producing itINFINEON TECHNOLOGIES AG·Filed 2004·Granted Sep 11, 2007·12 cites·17 claims
- 4469US8990744B2Electrical measurement based circuit wiring layout modification method and systemINFINEON TECHNOLOGIES AG·Filed 2013·Granted Mar 24, 2015·3 cites·30 claims
- 4569US8912638B2Semiconductor device with hollow structureTHEUSS HORST·Filed 2011·Granted Dec 16, 2014·2 cites·16 claims
- 4669US8872315B2Electronic device and method of fabricating an electronic deviceHOSSEINI KHALIL·Filed 2012·Granted Oct 28, 2014·2 cites·15 claims
- 4769US6841857B2Electronic component having a semiconductor chip, system carrier, and methods for producing the electronic component and the semiconductor chipINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jan 11, 2005·18 cites·22 claims
- 4868US9390973B2On-chip RF shields with backside redistribution linesINFINEON TECHNOLOGIES AG·Filed 2014·Granted Jul 12, 2016·1 cites·18 claims
- 4968US6058020AComponent housing for surface mounting of a semiconductor componentSIEMENS AG·Filed 1998·Granted May 2, 2000·36 cites·10 claims
- 5066US9129959B2Method for manufacturing an electronic module and an electronic moduleFUERGUT EDWARD·Filed 2012·Granted Sep 8, 2015·2 cites·26 claims
Showing the top 50 of 93 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →