Inventor · disambiguated record
Gobinda Das
Also filed as: DAS GOBINDA
12 granted patents·1 pending application·494 citations·filing 1976–2022
93Inventor score
Top patents by PatentIndex Score
13 records- 0196US7007380B2TFI probe I/O wrap test methodIBM·Filed 2004·Granted Mar 7, 2006·111 cites·5 claims
- 0289US6156484AGray scale etching for thin flexible interposerIBM·Filed 1998·Granted Dec 5, 2000·78 cites·12 claims
- 0387US6411112B1Off-axis contact tip and dense packing design for a fine pitch probeIBM·Filed 1998·Granted Jun 25, 2002·75 cites·14 claims
- 0478US6731128B2TFI probe I/O wrap test methodIBM·Filed 2002·Granted May 4, 2004·17 cites·10 claims
- 0578US5059553AMetal bump for a thermal compression bond and method for making sameIBM·Filed 1991·Granted Oct 22, 1991·70 cites·5 claims
- 0676US5973928AMulti-layer ceramic substrate decouplingIBM·Filed 1998·Granted Oct 26, 1999·54 cites·27 claims
- 0772US4069068ASemiconductor fabrication method for improved device yield by minimizing pipes between common conductivity type regionsIBM·Filed 1976·Granted Jan 17, 1978·28 cites·9 claims
- 0871US12259850B2Space efficient distributed storage systemsRED HAT INC·Filed 2022·Granted Mar 25, 2025·0 cites·20 claims
- 0970US6426636B1Wafer probe interface arrangement with nonresilient probe elements and support structureIBM·Filed 1998·Granted Jul 30, 2002·37 cites·11 claims
- 1058US11550755B2High performance space efficient distributed storageRED HAT INC·Filed 2018·Granted Jan 10, 2023·0 cites·20 claims
- 1155US8524596B2Techniques for improving bond pad performanceBEAULIEU FREDERIC·Filed 2012·Granted Sep 3, 2013·1 cites·20 claims
- 1251US5053851AMetal bump for a thermal compression bond and method for making sameIBM·Filed 1991·Granted Oct 1, 1991·23 cites·8 claims
- 1343US2006244138A1Techniques for improving bond pad performanceIBM·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →