Inventor · disambiguated record
Gorou Ikegami
Also filed as: IKEGAMI GOROU
11 granted patents·7 pending applications·326 citations·filing 1998–2007
92Inventor score
Top patents by PatentIndex Score
18 records- 0192US6137184AFlip-chip type semiconductor device having recessed-protruded electrodes in press-fit contactNEC CORP·Filed 1998·Granted Oct 24, 2000·149 cites·19 claims
- 0285US6617688B2Semiconductor device and flat electrodesNEC ELECTRONICS CORP·Filed 2002·Granted Sep 9, 2003·46 cites·9 claims
- 0377US6674178B1Semiconductor device having dispersed filler between electrodesNEC ELECTRONICS CORP·Filed 2000·Granted Jan 6, 2004·27 cites·13 claims
- 0472US6433426B1Semiconductor device having a semiconductor with bump electrodesNEC CORP·Filed 2000·Granted Aug 13, 2002·17 cites·8 claims
- 0572US6194781B1Semiconductor device and method of fabricating the sameNEC CORP·Filed 1998·Granted Feb 27, 2001·38 cites·16 claims
- 0671US6653171B2Flip-chip type semiconductor device having split voids within under-fill layer and its manufacturing methodNEC ELECTRONICS CORP·Filed 2001·Granted Nov 25, 2003·18 cites·5 claims
- 0757US6670706B2Semiconductor device including a semiconductor pellet having bump electrodes connected to pad electrodes of an interconnect board and method for manufacturing sameNEC CORP·Filed 2000·Granted Dec 30, 2003·7 cites·8 claims
- 0850US6794762B2Electronic component and fabrication method thereofNEC ELECTRONICS CORP·Filed 2003·Granted Sep 21, 2004·7 cites·13 claims
- 0946US6406989B1Method of fabricating semiconductor device with bump electrodesNEC CORP·Filed 1999·Granted Jun 18, 2002·13 cites·26 claims
- 1045US6608372B2Surface mountable chip type semiconductor device and manufacturing methodNEC ELECTRONICS CORP·Filed 2002·Granted Aug 19, 2003·2 cites·20 claims
- 1145US6504240B2Semiconductor device having reliable coupling between wiring substrate and semiconductor pelletNEC CORP·Filed 2000·Granted Jan 7, 2003·2 cites·11 claims
- 1242US2007194457A1Semiconductor package featuring thin semiconductor substrate and liquid crystal polymer sheet, and method for manufacturing such semiconductor packageNEC ELECTRONICS COROPORATION·Filed 2007·Application pending·0 cites
- 1337US2003036220A1Printed circuit board having plating conductive layer with bumps and its manufacturing methodFiled 2002·Application pending·0 cites
- 1434US2003058629A1Wiring substrate for small electronic component and manufacturing methodFiled 2002·Application pending·0 cites
- 1534US2001026015A1Semiconductor device having reliable electrical connectionNEC CORP·Filed 2001·Application pending·0 cites
- 1633US2002048905A1Chip-type semiconductor deviceFiled 2001·Application pending·0 cites
- 1732US2003104184A1Multiple wiring boardNEC ELECTRONICS CORP·Filed 2002·Application pending·0 cites
- 1828US2001013652A1Semiconductor device free from short-circuit between bump electrodes and separation from circuit board and process of fabrication thereofFiled 1998·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →