Inventor · disambiguated record
Goro Izuta
Also filed as: IZUTA GORO
4 granted patents·1 pending application·176 citations·filing 1994–2006
81Inventor score
Files withMITSUBISHI ELECTRIC CORP5
Top patents by PatentIndex Score
5 records- 0182US7361983B2Semiconductor device and semiconductor assembly module with a gap-controlling lead structureMITSUBISHI ELECTRIC CORP·Filed 2003·Granted Apr 22, 2008·37 cites·19 claims
- 0278US5950908ASolder supplying method, solder supplying apparatus and soldering methodMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Sep 14, 1999·58 cites·15 claims
- 0375US5821762ASemiconductor device, production method therefor, method for testing semiconductor elements, test substrate for the method and method for producing the test substrateMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Oct 13, 1998·52 cites·18 claims
- 0462US5609287ASolder material, junctioning method, junction material, and semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1994·Granted Mar 11, 1997·29 cites·19 claims
- 0543US2007235503A1Solder alloy and soldering methodMITSUBISHI ELECTRIC CORP·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →