Inventor · disambiguated record
Gopal C. Jha
Also filed as: JHA GOPAL C
3 granted patents·11 citations·filing 2010–2013
63Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0168US9313881B2Through mold via relief gutter on molded laser package (MLP) packagesQUALCOMM INC·Filed 2013·Granted Apr 12, 2016·3 cites·32 claims
- 0264US8753926B2Electronic packaging with a variable thickness mold capHEALY CHRISTOPHER J·Filed 2010·Granted Jun 17, 2014·4 cites·17 claims
- 0364US8546921B2Hybrid multilayer substrateRAMADOSS VIVEK·Filed 2010·Granted Oct 1, 2013·4 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →