Inventor · disambiguated record
Gongmyeong Kim
Also filed as: KIM GONGMYEONG
0 granted patents·5 pending applications·0 citations·filing 2023–2024
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD5
Top patents by PatentIndex Score
5 records- 0154US2025174596A1Method of manufacturing semiconductor package and apparatus for manufacturing semiconductor package used thereforSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0254US2025201757A1Chip bonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0354US2025219014A1Semiconductor reflow apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0451US2024321823A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0547US2024049400A1Solder reflow apparatus and method of manufacturing an electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →