Inventor · disambiguated record
Goon-Woo Kim
Also filed as: KIM GOON-WOO
1 granted patent·4 pending applications·2 citations·filing 2005–2011
19Inventor score
Top patents by PatentIndex Score
5 records- 0149US8156636B2Apparatus to manufacture a semiconductor package having a buffer disposed adjacent to a process unit of the apparatusKIM GOON WOO·Filed 2009·Granted Apr 17, 2012·2 cites·13 claims
- 0240US2008111230A1Wiring film having wire, semiconductor package including the wiring film, and method of fabricating the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 0339US2007052094A1Semiconductor wafer level chip package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 0429US2006003491A1Apparatus for ejecting relatively thin IC chip from semiconductor waferKIM GOON-WOO·Filed 2005·Application pending·0 cites
- 0527US2012108035A1Method of Fabricating Semiconductor DeviceKIM GOON-WOO·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →