Inventor · disambiguated record
Gorley Lau
Also filed as: LAU GORLEY · LAU GORLEY L
9 granted patents·197 citations·filing 1997–2002
89Inventor score
Files withCYPRESS SEMICONDUCTOR CORP9
Top patents by PatentIndex Score
9 records- 0185US6140228ALow temperature metallization processCYPRESS SEMICONDUCTOR CORP·Filed 1997·Granted Oct 31, 2000·69 cites·24 claims
- 0280US6969448B1Method for forming a metallization structure in an integrated circuitCYPRESS SEMICONDUCTOR CORP·Filed 1999·Granted Nov 29, 2005·60 cites·21 claims
- 0377US6756302B1Low temperature metallization processCYPRESS SEMICONDUCTOR CORP·Filed 2000·Granted Jun 29, 2004·19 cites·23 claims
- 0463US6774033B1Metal stack for local interconnect layerCYPRESS SEMICONDUCTOR CORP·Filed 2002·Granted Aug 10, 2004·11 cites·17 claims
- 0554US6187667B1Method of forming metal layer(s) and/or antireflective coating layer(s) on an integrated circuitCYPRESS SEMICONDUCTOR CORP·Filed 1998·Granted Feb 13, 2001·16 cites·19 claims
- 0649US6977217B1Aluminum-filled via structure with barrier layerCYPRESS SEMICONDUCTOR CORP·Filed 2002·Granted Dec 20, 2005·4 cites·9 claims
- 0749US6534398B2Method of forming metal layer(s) and/or antireflective coating layer(s) on an integrated circuitCYPRESS SEMICONDUCTOR CORP·Filed 2001·Granted Mar 18, 2003·2 cites·36 claims
- 0838US6455427B1Method for forming void-free metallization in an integrated circuitCYPRESS SEMICONDUCTOR CORP·Filed 1999·Granted Sep 24, 2002·7 cites·20 claims
- 0937US6906421B1Method of forming a low resistivity Ti-containing interconnect and semiconductor device comprising the sameCYPRESS SEMICONDUCTOR CORP·Filed 1998·Granted Jun 14, 2005·9 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →