Inventor · disambiguated record
Gong Ouyang
Also filed as: OUYANG GONG
12 granted patents·3 pending applications·22 citations·filing 2014–2023
85Inventor score
Top patents by PatentIndex Score
15 records- 0195US9922751B2Helically insulated twinax cable systems and methodsINTEL CORP·Filed 2016·Granted Mar 20, 2018·9 cites·10 claims
- 0284US9338882B2Broadside coupled differential transmission lines having alternating wide and narrow portionsINTEL CORP·Filed 2014·Granted May 10, 2016·6 cites·24 claims
- 0380US9318850B2Shielding a connector to reduce interferenceINTEL CORP·Filed 2014·Granted Apr 19, 2016·4 cites·16 claims
- 0476US9935353B2Printed circuit board having a signal conductor disposed adjacent one or more trenches filled with a low-loss ambient mediumINTEL CORP·Filed 2015·Granted Apr 3, 2018·2 cites·18 claims
- 0573US11903138B2Fine feature formation techniques for printed circuit boardsINTEL CORP·Filed 2021·Granted Feb 13, 2024·0 cites·24 claims
- 0656US11089689B2Fine feature formation techniques for printed circuit boardsINTEL CORP·Filed 2016·Granted Aug 10, 2021·0 cites·25 claims
- 0752US2025174569A1Crosstalk reduction using trace coupling in integrated circuit componentsMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2023·Application pending·0 cites
- 0851US10128591B2Electrical connectorINTEL CORP·Filed 2015·Granted Nov 13, 2018·1 cites·16 claims
- 0949US10304593B2Data carrying cable with mixed-gauge conductors to achieve longer reach and flexibilityMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2017·Granted May 28, 2019·0 cites·20 claims
- 1049US9894752B2Inductors for circuit board through hole structuresINTEL CORP·Filed 2015·Granted Feb 13, 2018·0 cites·12 claims
- 1147US9791899B2Method to realize reconfigurable memory topologyINTEL CORP·Filed 2015·Granted Oct 17, 2017·0 cites·22 claims
- 1238US9935036B2Package assembly with gathered insulated wiresINTEL CORP·Filed 2015·Granted Apr 3, 2018·0 cites·25 claims
- 1336US10249924B2Compact via structures and method of making sameINTEL CORP·Filed 2015·Granted Apr 2, 2019·0 cites·13 claims
- 1436US2016276091A1Inductors for circuit board through hole structuresINTEL CORP·Filed 2015·Application pending·0 cites
- 1536US2018174940A1Fine-featured traces for integrated circuit package support structuresINTEL CORP·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →