Inventor · disambiguated record
Govindasamy Rajendran
Also filed as: RAJENDRAN GOVINDASAMY P · RAJENDRAN GOVINDASAMY PARAMASI
2 granted patents·1 pending application·43 citations·filing 2002–2007
56Inventor score
Top patents by PatentIndex Score
3 records- 0188US6890635B2Low loss dielectric material for printed circuit boards and integrated circuit chip packagingDU PONT·Filed 2003·Granted May 10, 2005·43 cites·28 claims
- 0245US2007231581A1Epoxy with low coefficient of thermal expansionLIN PUI-YAN·Filed 2007·Application pending·0 cites
- 0343US6835335B2Process for crystallizing at least a portion of a crystallizable condensation homopolymer to form solid particlesINVISTA NORTH AMERICA SARL·Filed 2002·Granted Dec 28, 2004·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →