Inventor · disambiguated record
Go Saito
Also filed as: SAITO GO
17 granted patents·7 pending applications·505 citations·filing 1994–2013
95Inventor score
Files withTOYO SEIKAN KAISHA LTD7HITACHI HIGH TECH CORP4HITACHI LTD4ARASE TAKAO1HITACHI TECHNOLOGIES CORP1
Top patents by PatentIndex Score
24 records- 0196US7364956B2Method for manufacturing semiconductor devicesHITACHI HIGH TECH CORP·Filed 2005·Granted Apr 29, 2008·163 cites·4 claims
- 0292USD605502SPackaging containerTOYO SEIKAN KAISHA LTD·Filed 2009·Granted Dec 8, 2009·76 cites·1 claims
- 0392US6349838B1Plastic bottle and method of producing the sameTOYO SEIKAN KAISHA LTD·Filed 1999·Granted Feb 26, 2002·79 cites·4 claims
- 0489US7396771B2Plasma etching apparatus and plasma etching methodHITACHI HIGH TECH CORP·Filed 2006·Granted Jul 8, 2008·15 cites·4 claims
- 0587US6716386B2Plastic bottle and method of producing the sameTOYO SEIKAN KAISHA LTD·Filed 2002·Granted Apr 6, 2004·25 cites·7 claims
- 0687US6680094B2Packaging material and multi-layer containerTOYO SEIKAN KAISHA LTD·Filed 2001·Granted Jan 20, 2004·26 cites·12 claims
- 0786US7224568B2Plasma processing method and plasma processing apparatusHITACHI HIGH TECH CORP·Filed 2005·Granted May 29, 2007·12 cites·12 claims
- 0884US6878774B2Resin composition and multi-layer container using the sameTOYO SEIKAN KAISHA LTD·Filed 2001·Granted Apr 12, 2005·20 cites·5 claims
- 0975US8232347B2Method of making oxygen-absorbing resin compositionISHIHARA TAKAYUKI·Filed 2010·Granted Jul 31, 2012·2 cites·5 claims
- 1074US5681424APlasma processing methodHITACHI LTD·Filed 1994·Granted Oct 28, 1997·54 cites·21 claims
- 1170US6620737B2Plasma etching methodHITACHI LTD·Filed 2001·Granted Sep 16, 2003·13 cites·9 claims
- 1264US6617255B2Plasma processing method for working the surface of semiconductor devicesHITACHI LTD·Filed 2001·Granted Sep 9, 2003·7 cites·3 claims
- 1363US6709984B2Method for manufacturing semiconductor deviceHITACHI HIGH TECH CORP·Filed 2002·Granted Mar 23, 2004·9 cites·2 claims
- 1463US2008152915A1Pellet for oxygen-absorbing resin composition and oxygen-absorbing resin compositionTOYO SEIKAN KAISHA LTD·Filed 2008·Application pending·0 cites
- 1559US8440513B2Method of semiconductor processingONO TETSUO·Filed 2008·Granted May 14, 2013·1 cites·5 claims
- 1655US8580689B2Plasma processing methodICHIMARU TOMOYOSHI·Filed 2011·Granted Nov 12, 2013·1 cites·8 claims
- 1755US2004176536A1Resin composition and multi-layer container using the sameTOYO SEIKAN KAISHA LTD·Filed 2004·Application pending·0 cites
- 1852US10213991B2Multilayered containerTOYO SEIKAN GROUP HOLDINGS LTD·Filed 2013·Granted Feb 26, 2019·0 cites·2 claims
- 1950US7098138B2Plasma processing method for working the surface of semiconductor devicesHITACHI LTD·Filed 2003·Granted Aug 29, 2006·2 cites·2 claims
- 2049US2006048892A1Plasma processing method for working the surface of semiconductor devicesARASE TAKAO·Filed 2005·Application pending·0 cites
- 2145US2010004795A1Plasma processing method and plasma processing apparatusHITACHI TECHNOLOGIES CORP·Filed 2008·Application pending·0 cites
- 2245US2011156656A1Overcharge protection circuit, battery pack, and charging systemSAITO GO·Filed 2009·Application pending·0 cites
- 2336US2004048477A1Method for manufacturing semiconductor deviceFiled 2003·Application pending·0 cites
- 2426US2012003838A1Plasma etching methodOOKUMA KAZUMASA·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →