Inventor · disambiguated record
Gookmi Song
Also filed as: SONG GOOKMI
6 granted patents·1 pending application·0 citations·filing 2020–2025
67Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD7
Top patents by PatentIndex Score
7 records- 0174US12176308B2Package substrate and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Dec 24, 2024·0 cites·20 claims
- 0267US11756908B2Package substrate including a redistribution pad extending from a redistribution layer and including segmenting grooves along a redial direction thereof and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 12, 2023·0 cites·20 claims
- 0367US2025285951A1Semiconductor package including redistribution patternSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0462US11302661B2Package substrate including segment grooves arranged in a radial direction of a redistribution pad and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 12, 2022·0 cites·18 claims
- 0559US12388000B2Semiconductor package including redistribution patternSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 12, 2025·0 cites·20 claims
- 0652US12500218B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 16, 2025·0 cites·20 claims
- 0751US11894333B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 6, 2024·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →