Inventor · disambiguated record
Go Takeda
Also filed as: TAKEDA GO
9 granted patents·17 pending applications·230 citations·filing 1998–2023
83Inventor score
Top patents by PatentIndex Score
26 records- 0195US6329610B1Hybrid wiring board, semiconductor apparatus, flexible substrate, and fabrication method of hybrid wiring boardTOSHIBA KK·Filed 1998·Granted Dec 11, 2001·225 cites·37 claims
- 0289US11268004B2Boron nitride aggregated grainDENKA COMPANY LTD·Filed 2017·Granted Mar 8, 2022·2 cites·5 claims
- 0386US10752503B2Spherical boron nitride fine powder, method for manufacturing same and thermally conductive resin composition using sameDENKA COMPANY LTD·Filed 2017·Granted Aug 25, 2020·2 cites·9 claims
- 0473US10017386B2Spherical boron nitride fine particles and production method thereofDENKA COMPANY LTD·Filed 2015·Granted Jul 10, 2018·1 cites·1 claims
- 0569US11732173B2Surface-treated aggregated boron nitride powder, aggregated boron nitride powder, and thermally conductive resin compositionDENKA COMPANY LTD·Filed 2022·Granted Aug 22, 2023·0 cites·8 claims
- 0669US2025270435A1Boron nitride powder, method for producing same, and heat-dissipating sheetDENKA COMPANY LTD·Filed 2023·Application pending·0 cites
- 0762US2025215192A1Boron nitride powder, resin composition, and method for producing boron nitride powderDENKA COMPANY LTD·Filed 2023·Application pending·0 cites
- 0861US2023357007A1Boron nitride powder and method for producing boron nitride powderDENKA COMPANY LTD·Filed 2021·Application pending·0 cites
- 0961US2023357008A1Boron nitride powder, and method for producing boron nitride powderDENKA COMPANY LTD·Filed 2021·Application pending·0 cites
- 1057US2022154059A1Boron nitride aggregated particles, thermal conductive resin composition, and heat dissipation memberDENKA COMPANY LTD·Filed 2020·Application pending·0 cites
- 1157US2018230012A1Method of producing spherical boron nitride fine particlesDENKA COMPANY LTD·Filed 2018·Application pending·0 cites
- 1257US2023399264A1Boron nitride powder and method for producing boron nitride powderDENKA COMPANY LTD·Filed 2021·Application pending·0 cites
- 1357US2022153583A1Bulk boron nitride particles, thermally conductive resin composition, and heat dissipating memberDENKA COMPANY LTD·Filed 2020·Application pending·0 cites
- 1457US2022204830A1Boron nitride powder, method for producing same, composite material, and heat dissipation memberDENKA COMPANY LTD·Filed 2020·Application pending·0 cites
- 1552US10017387B2Boron nitride fine particles and production method thereofDENKA COMPANY LTD·Filed 2015·Granted Jul 10, 2018·0 cites·2 claims
- 1651US2015137037A1Method for treating surface of phosphor, phosphor, light-emitting device, and illumination deviceDENKI KAGAKU KOGYO KK·Filed 2013·Application pending·0 cites
- 1751US2022402759A1Hexagonal boron nitride powderDENKA COMPANY LTD·Filed 2020·Application pending·0 cites
- 1850US9399731B2Phosphor, method for producing the same, and luminescent device using the sameDENKI KAGAKU KOGYO KK·Filed 2013·Granted Jul 26, 2016·0 cites·16 claims
- 1950US2022388845A1Boron nitride powder and production method therefor, boron carbonitride powder, composite material, and heat dissipating memberDENKA COMPANY LTD·Filed 2020·Application pending·0 cites
- 2043US2018230352A1Thermally conductive resin compositionDENKA COMPANY LTD·Filed 2016·Application pending·0 cites
- 2142US12187608B2Boron nitride powder, method for producing same, and heat-dissipating member produced using sameDENKA COMPANY LTD·Filed 2018·Granted Jan 7, 2025·0 cites·4 claims
- 2242US2021163288A1Hexagonal boron nitride powder and method for producing hexagonal boron nitride powderDENKA COMPANY LTD·Filed 2019·Application pending·0 cites
- 2341US2021261413A1Aggregate boron nitride particles, boron nitride powder, production method for boron nitride powder, resin composition, and heat dissipation memberDENKA COMPANY LTD·Filed 2019·Application pending·0 cites
- 2439US9163175B2β-sialon and method of manufacturing thereof, and light-emitting deviceTAKEDA GO·Filed 2011·Granted Oct 20, 2015·0 cites·11 claims
- 2537US2002046880A1Hybrid wiring board, semiconductor apparatus, flexible substrate, and fabrication method of hybrid wiring boardTOSHIBA KK·Filed 2001·Application pending·0 cites
- 2634US2012298919A1Method of manufacturing beta-sialonTAKEDA GO·Filed 2011·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Go Takeda files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →