Inventor · disambiguated record
Greg L. Allen
Also filed as: ALLEN GREG L
7 granted patents·5 pending applications·322 citations·filing 1991–2016
88Inventor score
Files withHEWLETT PACKARD CO2HEWLETT PACKARD DEVELOPMENT CO2ALLEN GREG L1BIDTOURZ INC1BRIGGS RANDALL D1
Top patents by PatentIndex Score
12 records- 0196US6659512B1Integrated circuit package employing flip-chip technology and method of assemblyHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Dec 9, 2003·142 cites·11 claims
- 0291USD755790SIn line smart print moduleMARVELL INT LTD·Filed 2014·Granted May 10, 2016·56 cites·1 claims
- 0379USD818480SDisplay screen or portion thereof with graphical user interface for tour bidding servicesBIDTOURZ INC·Filed 2016·Granted May 22, 2018·30 cites·1 claims
- 0477US7002254B2Integrated circuit package employing flip-chip technology and method of assemblyHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Feb 21, 2006·18 cites·10 claims
- 0567US9354837B2Methods and apparatus for interfacing a host device to a peripheral device in order to increase consumption of consumable products by the peripheral deviceMARVELL WORLD TRADE LTD·Filed 2013·Granted May 31, 2016·2 cites·9 claims
- 0667US5253357ASystem for determining pluggable memory characteristics employing a status register to provide information in response to a preset field of an addressHEWLETT PACKARD CO·Filed 1991·Granted Oct 12, 1993·57 cites·6 claims
- 0751US5444827AMethod and apparatus for preventing print overruns by rasterizing complex page strips using an increased clock frequencyHEWLETT PACKARD CO·Filed 1994·Granted Aug 22, 1995·17 cites·9 claims
- 0844US2005268023A1Multi-port random access memoryBRIGGS RANDALL D·Filed 2004·Application pending·0 cites
- 0940US2007086035A1Printer controller apparatus implemented as a system in a packageWHELESS THOMAS O JR·Filed 2005·Application pending·0 cites
- 1040US2006267221A1Integrated-circuit die having redundant signal pads and related integrated circuit, system, and methodALLEN GREG L·Filed 2005·Application pending·0 cites
- 1140US2004036152A1Integrated circuit package employing flip-chip technology and method of assemblyFiled 2003·Application pending·0 cites
- 1234US2004012094A1Flip-chip integrated circuit package and method of assemblyFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →