Inventor · disambiguated record
Gregory M. Chapman
Also filed as: CHAPMAN GREGORY M
28 granted patents·735 citations·filing 1989–2008
97Inventor score
Files withMICRON TECHNOLOGY INC28
Top patents by PatentIndex Score
28 records- 0197US7677429B2Concave face wire bond capillary and methodMICRON TECHNOLOGY INC·Filed 2008·Granted Mar 16, 2010·103 cites·9 claims
- 0297US7416107B2Concave face wire bond capillary and methodMICRON TECHNOLOGY INC·Filed 2005·Granted Aug 26, 2008·102 cites·4 claims
- 0397US6158647AConcave face wire bond capillaryMICRON TECHNOLOGY INC·Filed 1998·Granted Dec 12, 2000·162 cites·7 claims
- 0495US6439450B1Concave face wire bond capillaryMICRON TECHNOLOGY INC·Filed 2001·Granted Aug 27, 2002·119 cites·5 claims
- 0581US6311890B1Concave face wire bond capillaryMICRON TECHNOLOGY INC·Filed 2000·Granted Nov 6, 2001·17 cites·7 claims
- 0678US6966480B2Concave face wire bond capillary and methodMICRON TECHNOLOGY INC·Filed 2003·Granted Nov 22, 2005·13 cites·4 claims
- 0778US6683378B2System for singulating semiconductor components utilizing alignment pinsMICRON TECHNOLOGY INC·Filed 2003·Granted Jan 27, 2004·20 cites·27 claims
- 0875US5375320AMethod of forming "J" leads on a semiconductor deviceMICRON TECHNOLOGY INC·Filed 1992·Granted Dec 27, 1994·61 cites·9 claims
- 0971US6013535AMethod for applying adhesives to a lead frameMICRON TECHNOLOGY INC·Filed 1997·Granted Jan 11, 2000·30 cites·32 claims
- 1070US6638831B1Use of a reference fiducial on a semiconductor package to monitor and control a singulation methodMICRON TECHNOLOGY INC·Filed 2000·Granted Oct 28, 2003·15 cites·11 claims
- 1164US6595406B2Concave face wire bond capillary and methodMICRON TECHNOLOGY INC·Filed 2002·Granted Jul 22, 2003·12 cites·4 claims
- 1263US6607019B2Method and apparatus for application of adhesive tape to semiconductor devicesMICRON TECHNOLOGY INC·Filed 2001·Granted Aug 19, 2003·7 cites·45 claims
- 1360US6623592B1Methods for application of adhesive tape to semiconductor devicesMICRON TECHNOLOGY INC·Filed 2000·Granted Sep 23, 2003·6 cites·17 claims
- 1459US6956272B2Support frame for semiconductor packagesMICRON TECHNOLOGY INC·Filed 2004·Granted Oct 18, 2005·6 cites·41 claims
- 1557US6787382B1Method and system for singulating semiconductor componentsMICRON TECHNOLOGY INC·Filed 2001·Granted Sep 7, 2004·6 cites·26 claims
- 1656US7087133B2Methods for application of adhesive tape to semiconductor devicesMICRON TECHNOLOGY INC·Filed 2003·Granted Aug 8, 2006·4 cites·17 claims
- 1756US6883574B2Apparatus for application of adhesive tape to semiconductor devicesMICRON TECHNOLOGY INC·Filed 2003·Granted Apr 26, 2005·4 cites·27 claims
- 1854US7271018B2Method of forming a support frame for semiconductor packagesMICRON TECHNOLOGY INC·Filed 2005·Granted Sep 18, 2007·0 cites·20 claims
- 1953US6744134B2Use of a reference fiducial on a semiconductor package to monitor and control a singulation methodMICRON TECHNOLOGY INC·Filed 2002·Granted Jun 1, 2004·5 cites·25 claims
- 2051US6818460B2Method for applying adhesives to a lead frameMICRON TECHNOLOGY INC·Filed 2001·Granted Nov 16, 2004·3 cites·418 claims
- 2149US6890384B2Apparatus and method for modifying the configuration of an exposed surface of a viscous fluidMICRON TECHNOLOGY INC·Filed 2001·Granted May 10, 2005·2 cites·51 claims
- 2249US6485778B1Method of applying an adhesive material to lead fingers of a lead frameMICRON TECHNOLOGY INC·Filed 2000·Granted Nov 26, 2002·2 cites·20 claims
- 2348US6267167B1Method and apparatus for application of adhesive tape to semiconductor devicesMICRON TECHNOLOGY INC·Filed 1999·Granted Jul 31, 2001·9 cites·48 claims
- 2448US6096165AMethod and apparatus for application of adhesive tape to semiconductor devicesMICRON TECHNOLOGY INC·Filed 1997·Granted Aug 1, 2000·9 cites·3 claims
- 2547US6346152B1Method and apparatus for applying adhesives to a lead frameMICRON TECHNOLOGY INC·Filed 1999·Granted Feb 12, 2002·10 cites·99 claims
- 2641US7087116B2Apparatus for modifying the configuration of an exposed surface of a viscous fluidMICRON TECHNOLOGY INC·Filed 2003·Granted Aug 8, 2006·0 cites·163 claims
- 2735US6336973B1Apparatus and method for modifying the configuration of an exposed surface of a viscous fluidMICRON TECHNOLOGY INC·Filed 1997·Granted Jan 8, 2002·3 cites·22 claims
- 2835US4977993AOut-of-tube inspection part holderMICRON TECHNOLOGY INC·Filed 1989·Granted Dec 18, 1990·5 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →