Inventor · disambiguated record
Gregory M. Fritz
Also filed as: FRITZ GREGORY · FRITZ GREGORY M
36 granted patents·3 pending applications·163 citations·filing 2009–2018
97Inventor score
Files withIBM25CHARLES STARK DRAPER LABORATORY INC4EVOLVE MFG LLC3EDELSTEIN DANIEL C2FRITZ GREGORY M2
Top patents by PatentIndex Score
39 records- 0196US9586857B2Controlling fragmentation of chemically strengthened glassIBM·Filed 2015·Granted Mar 7, 2017·13 cites·20 claims
- 0296US8816717B2Reactive material for integrated circuit tamper detection and responseIBM·Filed 2012·Granted Aug 26, 2014·26 cites·24 claims
- 0394US9431354B2Activating reactions in integrated circuits through electrical dischargeIBM·Filed 2014·Granted Aug 30, 2016·12 cites·9 claims
- 0494US8759976B2Structure with sub-lithographic random conductors as a physical unclonable functionEDELSTEIN DANIEL C·Filed 2012·Granted Jun 24, 2014·18 cites·19 claims
- 0592US9786550B2Low resistance metal contacts to interconnectsIBM·Filed 2015·Granted Oct 10, 2017·8 cites·11 claims
- 0691US8861728B2Integrated circuit tamper detection and responseIBM·Filed 2012·Granted Oct 14, 2014·12 cites·23 claims
- 0787US9151043B1Wall-panel system for façade materialsEVOLVE MFG LLC·Filed 2014·Granted Oct 6, 2015·17 cites·9 claims
- 0886US10128185B2Hybrid subtractive etch/metal fill process for fabricating interconnectsIBM·Filed 2017·Granted Nov 13, 2018·3 cites·19 claims
- 0985US9646881B2Hybrid subtractive etch/metal fill process for fabricating interconnectsIBM·Filed 2016·Granted May 9, 2017·3 cites·20 claims
- 1084US10396469B1Method for manufacturing three-dimensional electronic circuitCHARLES STARK DRAPER LABORATORY INC·Filed 2016·Granted Aug 27, 2019·7 cites·40 claims
- 1184US9738560B2Controlling fragmentation of chemically strengthened glassIBM·Filed 2016·Granted Aug 22, 2017·2 cites·20 claims
- 1283US8860176B2Multi-doped silicon antifuse device for integrated circuitIBM·Filed 2012·Granted Oct 14, 2014·6 cites·18 claims
- 1380US10881788B2Delivery device including reactive material for programmable discrete delivery of a substanceIBM·Filed 2015·Granted Jan 5, 2021·4 cites·14 claims
- 1479US10622590B2Method of forming a homogeneous solid metallic anode for a thin film microbatteryIBM·Filed 2018·Granted Apr 14, 2020·0 cites·17 claims
- 1579US10170361B2Thin film interconnects with large grainsIBM·Filed 2014·Granted Jan 1, 2019·4 cites·16 claims
- 1679US9453337B2Wall-panel system for façade materialsEVOLVE MFG LLC·Filed 2015·Granted Sep 27, 2016·8 cites·12 claims
- 1776US9799552B2Low resistance metal contacts to interconnectsIBM·Filed 2015·Granted Oct 24, 2017·2 cites·8 claims
- 1873US9382167B2Layered reactive particles with controlled geometries, energies, and reactivities, and methods for making the sameUNIV JOHNS HOPKINS·Filed 2013·Granted Jul 5, 2016·1 cites·10 claims
- 1973US8431197B2Layered reactive particles with controlled geometries, energies, and reactivities, and methods for making the sameFRITZ GREGORY M·Filed 2009·Granted Apr 30, 2013·2 cites·10 claims
- 2072US10727121B2Thin film interconnects with large grainsELPIS TECH INC·Filed 2018·Granted Jul 28, 2020·1 cites·10 claims
- 2172US10214809B2Energy release using tunable reactive materialsIBM·Filed 2018·Granted Feb 26, 2019·0 cites·12 claims
- 2271US9991214B2Activating reactions in integrated circuits through electrical dischargeIBM·Filed 2016·Granted Jun 5, 2018·1 cites·10 claims
- 2371US9259083B1Countertop and method of manufacturing the sameEVOLVE MFG LLC·Filed 2014·Granted Feb 16, 2016·7 cites·7 claims
- 2471US8987130B2Reactive bonding of a flip chip packageFRITZ GREGORY M·Filed 2012·Granted Mar 24, 2015·3 cites·17 claims
- 2569US10096802B2Homogeneous solid metallic anode for thin film microbatteryIBM·Filed 2014·Granted Oct 9, 2018·1 cites·14 claims
- 2667US9970102B2Energy release using tunable reactive materialsIBM·Filed 2016·Granted May 15, 2018·0 cites·13 claims
- 2767US8772161B2Annealing copper interconnectsCABRAL JR CYRIL·Filed 2011·Granted Jul 8, 2014·2 cites·23 claims
- 2859US10388615B2Activating reactions in integrated circuits through electrical dischargeIBM·Filed 2017·Granted Aug 20, 2019·0 cites·10 claims
- 2958US10236252B2Hybrid subtractive etch/metal fill process for fabricating interconnectsIBM·Filed 2017·Granted Mar 19, 2019·0 cites·18 claims
- 3057US9653395B2Hybrid subtractive etch/metal fill process for fabricating interconnectsIBM·Filed 2016·Granted May 16, 2017·0 cites·20 claims
- 3156US10262955B2Activating reactions in integrated circuits through electrical dischargeIBM·Filed 2016·Granted Apr 16, 2019·0 cites·9 claims
- 3255US10217661B2Articles including ultra low dielectric layersIBM·Filed 2017·Granted Feb 26, 2019·0 cites·20 claims
- 3354US2017040257A1Hybrid subtractive etch/metal fill process for fabricating interconnectsIBM·Filed 2015·Application pending·0 cites
- 3448US10240058B2Reactively assisted ink for printed electronic circuitsCHARLES STARK DRAPER LABORATORY INC·Filed 2018·Granted Mar 26, 2019·0 cites·19 claims
- 3548US9773698B2Method of manufacturing an ultra low dielectric layerIBM·Filed 2015·Granted Sep 26, 2017·0 cites·18 claims
- 3647US10354962B2Method and apparatus for a destroy on-demand electrical deviceCHARLES STARK DRAPER LABORATORY INC·Filed 2016·Granted Jul 16, 2019·0 cites·23 claims
- 3747US10308828B2Reactively assisted ink for printed electronic circuitsCHARLES STARK DRAPER LABORATORY INC·Filed 2017·Granted Jun 4, 2019·0 cites·25 claims
- 3844US2015137366A1Reactive bonding of a flip chip packageIBM·Filed 2015·Application pending·0 cites
- 3941US2014042627A1Electronic structure containing a via array as a physical unclonable functionEDELSTEIN DANIEL C·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →