Inventor · disambiguated record
Gregory Hindman
Also filed as: HINDMAN GREGORY · HINDMAN GREGORY T
11 granted patents·353 citations·filing 1992–2006
92Inventor score
Top patents by PatentIndex Score
11 records- 0190US5240880ATi/TiN/Ti contact metallizationZILOG INC·Filed 1992·Granted Aug 31, 1993·83 cites·1 claims
- 0288US5317187ATi/TiN/Ti contact metallizationZILOG INC·Filed 1993·Granted May 31, 1994·71 cites·3 claims
- 0387US5443713AThin-film structure method of fabricationHEWLETT PACKARD CORP·Filed 1994·Granted Aug 22, 1995·60 cites·22 claims
- 0477US6155674AStructure to effect adhesion between substrate and ink barrier in ink jet printheadHEWLETT PACKARD CO·Filed 1997·Granted Dec 5, 2000·37 cites·27 claims
- 0574US6286939B1Method of treating a metal surface to increase polymer adhesionHEWLETT PACKARD CO·Filed 1997·Granted Sep 11, 2001·32 cites·16 claims
- 0668US6209991B1Transition metal carbide films for applications in ink jet printheadsHEWLETT PACKARD CO·Filed 1997·Granted Apr 3, 2001·25 cites·24 claims
- 0767US6441838B1Method of treating a metal surface to increase polymer adhesionHEWLETT PACKARD CO·Filed 2001·Granted Aug 27, 2002·11 cites·22 claims
- 0860US7543917B2Integrated circuit and method for manufacturingHEWLETT PACKARD DEVELOPMENT CO·Filed 2006·Granted Jun 9, 2009·1 cites·28 claims
- 0953US5338423AMethod of eliminating metal voiding in a titanium nitride/aluminum processingZILOG INC·Filed 1992·Granted Aug 16, 1994·22 cites·14 claims
- 1041US7150516B2Integrated circuit and method for manufacturingHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Dec 19, 2006·1 cites·21 claims
- 1138US5244831AMethod of doping a polysilicon layer on a semiconductor waferZILOG INC·Filed 1992·Granted Sep 14, 1993·10 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →